Seo; Sunkyoung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seo; Sunkyoung.The latest application filed is for "chip-stacked semiconductor package and method of manufacturing same".
- Seo; Sunkyoung - Cheonan-si KR
- Seo; Sunkyoung - Suwon-si N/A KR
| Patent | Date |
|---|---|
| Semiconductor package Grant 11,444,060 - Han , et al. September 13, 2 | 2022-09-13 |
| Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20220262689 - KIM; Hyoeun ; et al. | 2022-08-18 |
| Semiconductor Package App 20220216186 - Han; Sanguk ; et al. | 2022-07-07 |
| Semiconductor Package Including High Thermal Conductivity Layer App 20220173008 - KIM; Sunjae ; et al. | 2022-06-02 |
| Semiconductor Package App 20220157780 - KWON; Ohguk ; et al. | 2022-05-19 |
| Chip-stacked semiconductor package and method of manufacturing same Grant 11,328,966 - Kim , et al. May 10, 2 | 2022-05-10 |
| Semiconductor Packages App 20220130802 - JUN; Joonho ; et al. | 2022-04-28 |
| Semiconductor Package App 20220122955 - CHO; YONGHOE ; et al. | 2022-04-21 |
| Semiconductor Package App 20220093543 - SEO; Sunkyoung ; et al. | 2022-03-24 |
| Semiconductor Package And Method Of Fabricating The Same App 20220052097 - KWON; Ohguk ; et al. | 2022-02-17 |
| Semiconductor packages including stacked substrates and penetration electrodes Grant 11,222,873 - Jun , et al. January 11, 2 | 2022-01-11 |
| Semiconductor Package And Method Of Manufacturing The Same App 20210398929 - KIM; HYOEUN ; et al. | 2021-12-23 |
| Semiconductor Package App 20210193581 - SEO; Sunkyoung ; et al. | 2021-06-24 |
| Semiconductor Packages App 20210183816 - JUN; Joonho ; et al. | 2021-06-17 |
| Semiconductor Package App 20210167040 - YOU; SE-HO ; et al. | 2021-06-03 |
| Semiconductor Package App 20210013181 - Han; Sanguk ; et al. | 2021-01-14 |
| Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20200411393 - Kim; Hyoeun ; et al. | 2020-12-31 |
| Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line Grant 10,192,855 - Seo , et al. Ja | 2019-01-29 |
| Semiconductor Package And Electronic Device Having Heat Dissipation App 20160133613 - SEO; SUNKYOUNG ; et al. | 2016-05-12 |
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