Seo; Sun Kyoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seo; Sun Kyoung.The latest application filed is for "semiconductor package with protective mold".

Company Profile

7.23.25

Seo; Sun Kyoung - Cheonan-si KR
SEO; Sun-kyoung - Yongin-si KR
Seo; Sun-kyoung - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package With Protective Mold App 20220077209 - Kim; Sun Jae ; et al.	2022-03-10
Semiconductor Package App 20210217735 - SEO; Sun-kyoung ; et al.	2021-07-15
Semiconductor package Grant 10,991,677 - Seo , et al. April 27, 2	2021-04-27
Semiconductor package Grant 10,867,970 - Seo , et al. December 15, 2	2020-12-15
Semiconductor Package App 20200286862 - SEO; Sun-kyoung ; et al.	2020-09-10
Semiconductor Package App 20200243488 - SEO; Sun-kyoung ; et al.	2020-07-30
Semiconductor package Grant 10,658,341 - Seo , et al.	2020-05-19
Semiconductor Package App 20190312013 - SEO; Sun-kyoung ; et al.	2019-10-10
Semiconductor package Grant 10,373,935 - Seo , et al.	2019-08-06
Semiconductor Package App 20180374825 - SEO; Sun-kyoung ; et al.	2018-12-27
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip Grant 10,134,702 - Seo , et al. November 20, 2	2018-11-20
Semiconductor package Grant 10,083,939 - Seo , et al. September 25, 2	2018-09-25
Semiconductor package Grant 10,008,462 - Seo , et al. June 26, 2	2018-06-26
Alignment mark for semiconductor device Grant 9,893,018 - Ko , et al. February 13, 2	2018-02-13
Semiconductor devices with solder-based connection terminals and method of forming the same Grant 9,831,202 - Seo , et al. November 28, 2	2017-11-28
Semiconductor Package App 20170338206 - SEO; Sun-kyoung ; et al.	2017-11-23
Semiconductor Chip, Semiconductor Package Including The Same, And Method Of Manufacturing Semiconductor Chip App 20170229412 - SEO; Sun-kyoung ; et al.	2017-08-10
Semiconductor Chip, Semiconductor Package Including The Same, And Method Of Manufacturing Semiconductor Chip App 20170170136 - SEO; Sun-kyoung ; et al.	2017-06-15
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip Grant 9,666,551 - Seo , et al. May 30, 2	2017-05-30
Semiconductor Devices With Solder-based Connection Terminals And Method Of Forming The Same App 20170084561 - Seo; Sun-kyoung ; et al.	2017-03-23
Semiconductor Package App 20170084558 - Seo; Sun-kyoung ; et al.	2017-03-23
Chip-stacked semiconductor package Grant 9,543,276 - Jee , et al. January 10, 2	2017-01-10
Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same Grant 9,449,930 - Kim , et al. September 20, 2	2016-09-20
Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package Grant 9,376,541 - Kang , et al. June 28, 2	2016-06-28
Chip-stacked Semiconductor Package App 20160056101 - JEE; Young-kun ; et al.	2016-02-25
Semiconductor Devices And Methods For Manufacturing The Same App 20160056113 - KO; Yeong-Kwon ; et al.	2016-02-25
Semiconductor Devices And Package Substrates Having Pillars And Semiconductor Packages And Package Stack Structures Having The Same App 20160049377 - KIM; Tae-Hyeong ; et al.	2016-02-18
Methods of fabricating package stack structure and method of mounting package stack structure on system board Grant 9,136,255 - Seo , et al. September 15, 2	2015-09-15
Non-conductive Film And Non-conductive Paste Including Zinc Particles, Semiconductor Package Including The Same, And Method Of Manufacturing The Semiconductor Package App 20150102485 - Kang; Un-byoung ; et al.	2015-04-16
Stacked Package, Method Of Fabricating Stacked Package, And Method Of Mounting Stacked Package Fabricated By The Method App 20140232005 - Yoo; Jae-Wook ; et al.	2014-08-21
Methods Of Fabricating Package Stack Structure And Method Of Mounting Package Stack Structure On System Board App 20140197529 - Seo; Sun-Kyoung ; et al.	2014-07-17
Semiconductor package having an anti-contact layer Grant 8,742,577 - Jee , et al. June 3, 2	2014-06-03
Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method Grant 8,735,221 - Yoo , et al. May 27, 2	2014-05-27
Methods of fabricating package stack structure and method of mounting package stack structure on system board Grant 8,698,317 - Seo , et al. April 15, 2	2014-04-15
Semiconductor Package App 20130087917 - Jee; Young-kun ; et al.	2013-04-11
Stacked Package, Method Of Fabricating Stacked Package, And Method Of Mounting Stacked Package Fabricated By The Method App 20120252163 - Yoo; Jae-Wook ; et al.	2012-10-04
Methods Of Fabricating Package Stack Structure And Method Of Mounting Package Stack Structure On System Board App 20120074586 - SEO; Sun-Kyoung ; et al.	2012-03-29

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