Seo; Sang-Hun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seo; Sang-Hun.The latest application filed is for "plasma generating apparatus and substrate processing apparatus".

Company Profile

5.8.13

Seo; Sang-Hun - Daejeon KR
Seo, Sang-Hun - Daejeon-city KR
Seo; Sang-Hun - Taejon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plasma Generating Apparatus And Substrate Processing Apparatus App 20200161096 - CHANG; Hong-Young ; et al.	2020-05-21
Plasma generating apparatus and substrate processing apparatus Grant 10,553,406 - Chang , et al. Fe	2020-02-04
Plasma Processing Apparatus App 20190006156 - SEO; Sang-Hun ; et al.	2019-01-03
Plasma Generating Apparatus And Substrate Treating Apparatus App 20140320016 - CHANG; Hong-Young ; et al.	2014-10-30
Plasma Generating Apparatus And Substrate Processing Apparatus App 20140007812 - Chang; Hong-Young ; et al.	2014-01-09
Plasma Generator App 20130255575 - CHANG; Hong-Young ; et al.	2013-10-03
Method for etching an object using a plasma and an object etched by a plasma Grant 7,491,344 - Park , et al. February 17, 2	2009-02-17
Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage Grant 7,258,811 - Chu , et al. August 21, 2	2007-08-21
Semiconductor device and methods of manufacturing the same App 20050151173 - Seo, Sang-Hun ; et al.	2005-07-14
Method of manufacturing the semiconductor device intended to prevent a leakage current from occuring due to a gate induced drain leakage effect Grant 6,855,590 - Seo , et al. February 15, 2	2005-02-15
Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage App 20040223286 - Chu, Chang-woong ; et al.	2004-11-11
Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage Grant 6,793,767 - Chu , et al. September 21, 2	2004-09-21
Semiconductor device and methods of manufacturing the same App 20040144981 - Seo, Sang-Hun ; et al.	2004-07-29
Method of manufacturing a contact of a semiconductor device using cluster apparatus having at least one plasma pretreatment module Grant 6,767,834 - Chung , et al. July 27, 2	2004-07-27
Method for etching an object using a plasma and an object etched by a plasma App 20040089632 - Park, Heung-Sik ; et al.	2004-05-13
Method for removing residual metal-containing polymer material and ion implanted photoresist in atmospheric downstream plasma jet system Grant 6,534,921 - Seo , et al. March 18, 2	2003-03-18
Conducting Line Of Semiconductor Device And Manufacturing Method Thereof Using Aluminum Oxide Layer As Hard Mask App 20020113310 - Kim, Ji-Soo ; et al.	2002-08-22
Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stage App 20020078891 - Chu, Chang-Woong ; et al.	2002-06-27
Method of manufacturing a contact of a semiconductor device using cluster apparatus having at least one plasma pretreatment module App 20020064944 - Chung, Seung-pil ; et al.	2002-05-30

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