Seo; Mu Hwan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seo; Mu Hwan.The latest application filed is for "semiconductor package having reduced thickness".
- Seo; Mu Hwan - Aspen Heights SG
| Patent | Date |
|---|---|
| Semiconductor Package Having Reduced Thickness App 20080283979 - Lee; Tae Heon ; et al. | 2008-11-20 |
| Semiconductor package having reduced thickness Grant 7,321,162 - Lee , et al. January 22, 2 | 2008-01-22 |
| Semiconductor package having reduced thickness Grant 7,115,445 - Lee , et al. October 3, 2 | 2006-10-03 |
| Leadframe and semiconductor package with improved solder joint strength Grant 7,102,208 - Lee , et al. September 5, 2 | 2006-09-05 |
| Semiconductor package having reduced thickness App 20040150086 - Lee, Tae Heon ; et al. | 2004-08-05 |
| Semiconductor package having reduced thickness Grant 6,696,747 - Lee , et al. February 24, 2 | 2004-02-24 |
| Semiconductor device having increased moisture path and increased solder joint strength Grant 6,525,406 - Chung , et al. February 25, 2 | 2003-02-25 |
| Method for making a semiconductor package having improved defect testing and increased production yield Grant 6,475,827 - Lee , et al. November 5, 2 | 2002-11-05 |
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