Seo; Joon Mo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seo; Joon Mo.The latest application filed is for "getter composition, and organic el display device comprising same".

Company Profile

2.16.27

Seo; Joon Mo - Uiwang-si N/A KR
Seo; Joon Mo - Seoul KR
Seo; Joon-Mo - Gyeonggi-do KR
Seo; Joon-Mo - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device connected by anisotropic conductive film Grant 10,504,866 - Park , et al. Dec	2019-12-10
Anisotropic conductive film and semiconductor device bonded by the same Grant 9,540,549 - Sul , et al. January 10, 2	2017-01-10
Electronic device using anisotropic conductive composition and film Grant 9,390,831 - Park , et al. July 12, 2	2016-07-12
Anisotropic conductive film and electronic device including the same Grant 9,048,240 - Park , et al. June 2, 2	2015-06-02
Getter Composition, And Organic El Display Device Comprising Same App 20150001441 - Seo; Joon Mo ; et al.	2015-01-01
Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same Grant 8,766,443 - Yu , et al. July 1, 2	2014-07-01
Semiconductor Device Connected By Anisotropic Conductive Film App 20140084468 - PARK; Young Woo ; et al.	2014-03-27
Anisotropic Conductive Film And Electronic Device Including The Same App 20130168847 - PARK; Young Woo ; et al.	2013-07-04
Anisotropic Conductive Film And Semiconductor Device Bonded By The Same App 20130154129 - SUL; Kyung Il ; et al.	2013-06-20
Semiconductor Devices Connected By Anisotropic Conductive Film Comprising Conductive Microspheres App 20130154095 - YU; Arum ; et al.	2013-06-20
Anisotropic Conductive Film Composition, Anisotropic Conductive Film, And Semiconductor Device Bonded By The Same App 20130154093 - YU; Arum ; et al.	2013-06-20
Electronic device using anisotropic conductive composition and film App 20130126788 - PARK; Kyoung Soo ; et al.	2013-05-23
Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same Grant 8,101,527 - Seo , et al. January 24, 2	2012-01-24
Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same Grant 7,968,977 - Seo , et al. June 28, 2	2011-06-28
Multifunctional Die Attachment Film And Semiconductor Packaging Using The Same App 20100317155 - Kang; Byoung-Un ; et al.	2010-12-16
Dicing Film Having Shrinkage Release Film And Method For Manufacturing Semiconductor Package Using The Same. App 20100197078 - Seo; Joon Mo ; et al.	2010-08-05
Dicing die attachment film and method for packaging semiconductor using same Grant 7,768,141 - Seo , et al. August 3, 2	2010-08-03
Squeeze For Screen Printer App 20100176084 - KANG; Young-Ju ; et al.	2010-07-15
Squeeze for screen printer Grant 7,743,701 - Kang , et al. June 29, 2	2010-06-29
Method For Packaging Semiconductor App 20100087067 - Seo; Joon-Mo ; et al.	2010-04-08
Adhesive Film For Semiconductor App 20090198013 - Shin; Dong-Cheon ; et al.	2009-08-06
Semiconductor packaging method Grant 7,553,701 - Seo , et al. June 30, 2	2009-06-30
Dicing Die Attachment Film And Method For Packaging Semiconductor Using Same App 20090091044 - Seo; Joon-Mo ; et al.	2009-04-09
Attach Paste Composition For Semiconductor Package App 20090088527 - Seo; Joon-Mo ; et al.	2009-04-02
Semiconductor Packaging Method App 20090053857 - Seo; Joon-Mo ; et al.	2009-02-26
Dicing die adhesive film for semiconductor Grant 7,485,494 - Kang , et al. February 3, 2	2009-02-03
Squeeze for screen printer App 20070199456 - Kang; Young-Ju ; et al.	2007-08-30
Die-attaching paste composition and method for hardening the same App 20070134847 - Kang; Byoung-Un ; et al.	2007-06-14
Dual printing mask for screen printing App 20070101877 - Seo; Joon-Mo ; et al.	2007-05-10
Dicing die adhesive film for semiconductor App 20060244132 - Kang; Byoung-Un ; et al.	2006-11-02
Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same App 20050215032 - Seo, Joon Mo ; et al.	2005-09-29

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