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Patent applications and USPTO patent grants for Senoo; Takehiko.The latest application filed is for "gas cluster processing device and gas cluster processing method".
Patent | Date |
---|---|
Cutting method Grant 11,380,586 - Manabe , et al. July 5, 2 | 2022-07-05 |
Gas Cluster Processing Device And Gas Cluster Processing Method App 20220143655 - DOBASHI; Kazuya ;   et al. | 2022-05-12 |
Gas cluster processing device and gas cluster processing method Grant 11,267,021 - Dobashi , et al. March 8, 2 | 2022-03-08 |
Gas Cluster Processing Device and Gas Cluster Processing Method App 20210107041 - DOBASHI; Kazuya ;   et al. | 2021-04-15 |
Cutting Method App 20200365460 - MANABE; Toshiki ;   et al. | 2020-11-19 |
Cutting Method App 20200365461 - MANABE; Toshiki ;   et al. | 2020-11-19 |
Method and apparatus for supplying mixed gas Grant 9,533,268 - Koike , et al. January 3, 2 | 2017-01-03 |
Substrate cleaning apparatus and vacuum processing system Grant 9,214,364 - Dobashi , et al. December 15, 2 | 2015-12-15 |
Dividing method for wafer Grant 9,159,622 - Matsuzaki , et al. October 13, 2 | 2015-10-13 |
Dividing Method For Wafer App 20150044857 - Matsuzaki; Sakae ;   et al. | 2015-02-12 |
Method And Apparatus For Supplying Mixed Gas App 20150020890 - KOIKE; Kunihiko ;   et al. | 2015-01-22 |
Processing Method Utilizing Cluster App 20140061031 - YOSHINO; Yu ;   et al. | 2014-03-06 |
Cluster jet processing method, semiconductor element, microelectromechanical element, and optical component Grant 8,461,051 - Koike , et al. June 11, 2 | 2013-06-11 |
Substrate Cleaning Apparatus And Vacuum Processing System App 20120247670 - DOBASHI; Kazuya ;   et al. | 2012-10-04 |
Vacuum Processing Apparatus, Vacuum Processing Method, and Micro-Machining Apparatus App 20120071003 - Dobashi; Kazuya ;   et al. | 2012-03-22 |
Cluster Jet Processing Method, Semiconductor Element, Microelectromechanical Element, And Optical Component App 20110147896 - Koike; Kunihiko ;   et al. | 2011-06-23 |
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