Senoo; Hideo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Senoo; Hideo.The latest application filed is for "coating composition, coating film, method of manufacturing coating film, and optical recording medium".

Company Profile

0.19.14

Senoo; Hideo - Kawaguchi-shi JP
Senoo; Hideo - Kawaguchi JP
Senoo; Hideo - Saitama JP
Senoo; Hideo - Wakou JP
Senoo; Hideo - Wako JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coating composition, coating film, method of manufacturing coating film, and optical recording medium App 20090291248 - Hongo; Yuki ; et al.	2009-11-26
Coating composition, coating film, method of manufacturing coating film, and optical recording medium Grant 7,589,130 - Hongo , et al. September 15, 2	2009-09-15
Sheet to Form a Protective Shield for Chips App 20080260982 - Senoo; Hideo ; et al.	2008-10-23
Sheet to form a protective film for chips Grant 7,408,259 - Senoo , et al. August 5, 2	2008-08-05
Coating composition, hard coat film, and optical disk Grant 7,384,676 - Hongo , et al. June 10, 2	2008-06-10
Semiconductor wafer protection structure and laminated protective sheet for use therein Grant 7,361,971 - Senoo , et al. April 22, 2	2008-04-22
Process for producing semiconductor chips having a protective film on the back surface Grant 7,235,465 - Senoo , et al. June 26, 2	2007-06-26
Process for producing a semiconductor device Grant 7,169,648 - Sato , et al. January 30, 2	2007-01-30
Adhesive tape Grant 7,135,224 - Sumi , et al. November 14, 2	2006-11-14
Coating composition, coating film, method of manufacturing coating film, and optical recording medium App 20060044993 - Hongo; Yuki ; et al.	2006-03-02
Protective structure of semiconductor wafer, method for protecting semiconductor wafer, multilayer protective sheet used therein, and method for processing semiconductor wafer App 20060043532 - Senoo; Hideo ; et al.	2006-03-02
Process for producing semiconductor chips having a protective film on the back surface App 20050186762 - Senoo, Hideo ; et al.	2005-08-25
Sheet to form a protective film for chips App 20050184402 - Senoo, Hideo ; et al.	2005-08-25
Process for producing semiconductor chips Grant 6,919,262 - Senoo , et al. July 19, 2	2005-07-19
Coating composition, hard coat film, and optical disk App 20050147809 - Hongo, Yuki ; et al.	2005-07-07
Process for producing a semiconductor device App 20050037542 - Sato, Akinori ; et al.	2005-02-17
Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same Grant 6,855,418 - Yamazaki , et al. February 15, 2	2005-02-15
Adhesive tape App 20040232563 - Sumi, Takaji ; et al.	2004-11-25
Reinforcement material for silicon wafer and process for producing IC chip using said material Grant 6,765,289 - Nakata , et al. July 20, 2	2004-07-20
Process for producing semiconductor device Grant 6,656,819 - Sugino , et al. December 2, 2	2003-12-02
Process for producing semiconductor device Grant 6,558,975 - Sugino , et al. May 6, 2	2003-05-06
Method of using a transfer tape Grant 6,544,371 - Senoo , et al. April 8, 2	2003-04-08
Tape for forming resin tie bar, resin tie bar, lead frame equipped with resin tie bar, resin-molded semiconductor device, and method for producing same App 20020192464 - Yamazaki, Osamu ; et al.	2002-12-19
Sheet to form a protective film for chips and process for producing semiconductor chips App 20020137309 - Senoo, Hideo ; et al.	2002-09-26
Dicing tape and a method of dicing a semiconductor wafer Grant 6,444,310 - Senoo , et al. September 3, 2	2002-09-03
Process for producing semiconductor device App 20020055238 - Sugino, Takashi ; et al.	2002-05-09
Reinforcement material for silicone wafer and process for producing IC chip using said material App 20020031863 - Nakata, Yasukazu ; et al.	2002-03-14
Method of using a transfer tape App 20020028331 - Senoo, Hideo ; et al.	2002-03-07
Process for preparing a semiconductor wafer Grant 6,297,076 - Amagai , et al. October 2, 2	2001-10-02
Adhesive composition and adhesive sheet Grant 6,277,481 - Sugino , et al. August 21, 2	2001-08-21
Adhesive sheet for wafer setting and process for producing electronic component Grant 6,042,922 - Senoo , et al. March 28, 2	2000-03-28
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet Grant 5,888,606 - Senoo , et al. March 30, 1	1999-03-30
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet Grant 5,705,016 - Senoo , et al. January 6, 1	1998-01-06

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