Senk; David D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Senk; David D..The latest application filed is for "system and method for forming filled vias and plated through holes".
- Senk; David D. - San Ramon CA
- Senk; David D. - Mission Viejo CA
| Patent | Date |
|---|---|
| Structuring and circuitizing printed circuit board through-holes Grant 7,935,895 - Senk , et al. May 3, 2 | 2011-05-03 |
| System And Method For Forming Filled Vias And Plated Through Holes App 20090188710 - Senk; David D. | 2009-07-30 |
| Structuring And Circuitizing Printed Circuit Board Through-holes App 20080073113 - SENK; DAVID D. ; et al. | 2008-03-27 |
| Resistive materials Grant 6,994,757 - Allen , et al. February 7, 2 | 2006-02-07 |
| Resistive materials Grant 6,846,370 - Allen , et al. January 25, 2 | 2005-01-25 |
| Resistive material App 20040257193 - Allen, Craig S. ; et al. | 2004-12-23 |
| Resistive materials App 20040231757 - Allen, Craig S. ; et al. | 2004-11-25 |
| Resistive materials App 20030121883 - Allen, Craig S. ; et al. | 2003-07-03 |
| Resistors App 20030016117 - Senk, David D. ; et al. | 2003-01-23 |
| Resistors App 20030016118 - Schemenaur, John ; et al. | 2003-01-23 |
| Resistors App 20030001719 - Schemenaur, John ; et al. | 2003-01-02 |
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