Senk; David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Senk; David.The latest application filed is for "printed circuit board comprising both conductive metal and optical elements".
- Senk; David - Spencer TN
- Senk; David - San Ramon CA US
- Senk; David - San Jose CA
| Patent | Date |
|---|---|
| Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament Grant 10,631,407 - Oliver , et al. | 2020-04-21 |
| Multiple layer printed circuit board with unplated vias Grant 8,889,999 - Thurairajaratnam , et al. November 18, 2 | 2014-11-18 |
| Printed Circuit Board Comprising Both Conductive Metal and Optical Elements App 20140119703 - Hinaga; Scott ; et al. | 2014-05-01 |
| Method And Apparatus For Determining Surface Roughness Of Metal Foil Within Printed Circuits App 20130108118 - Hinaga; Scott T. ; et al. | 2013-05-02 |
| Multiple Layer Printed Circuit Board App 20130098671 - THURAIRAJARATNAM; ARITHARAN ; et al. | 2013-04-25 |
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