Sengul; Ali

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sengul; Ali.The latest application filed is for "atomic force microscopy tips for interconnection".

Company Profile

4.13.6

Sengul; Ali - Zurich CH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hybrid interconnect for laser bonding using nanoporous metal tips Grant 11,424,214 - Brodoceanu , et al. August 23, 2	2022-08-23
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers Grant 11,404,600 - Wu , et al. August 2, 2	2022-08-02
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating Grant 11,374,148 - Brodoceanu , et al. June 28, 2	2022-06-28
Flexible interconnect using conductive adhesive Grant 11,349,053 - Chio , et al. May 31, 2	2022-05-31
Liquid crystalline elastomer for pick and place of semiconductor devices Grant 11,328,942 - Wallin , et al. May 10, 2	2022-05-10
Magnetic clamping interconnects Grant 11,296,268 - Sengul , et al. April 5, 2	2022-04-05
Bonding dummy electrodes of light emitting diode chip to substrate Grant 11,276,672 - Wu , et al. March 15, 2	2022-03-15
Bonding corners of light emitting diode chip to substrate using laser Grant 11,255,529 - Wu , et al. February 22, 2	2022-02-22
Curved pillar interconnects Grant 11,239,400 - Chio , et al. February 1, 2	2022-02-01
Fluidic pick-up head for assembling light emitting diodes Grant 11,107,948 - Menguc , et al. August 31, 2	2021-08-31
Pickup head with photocurable polymers for assembling light emitting diodes Grant 11,101,159 - Brodoceanu , et al. August 24, 2	2021-08-24
Atomic force microscopy tips for interconnection Grant 10,989,735 - Sengul , et al. April 27, 2	2021-04-27
Atomic Force Microscopy Tips For Interconnection App 20210055327 - Sengul; Ali ; et al.	2021-02-25
Employing Deformable Contacts And Pre-applied Underfill For Bonding Led Devices Via Lasers App 20200395504 - Brodoceanu; Daniel ; et al.	2020-12-17
Curing Pre-applied And Plasma-etched Underfill Via A Laser App 20200395519 - Brodoceanu; Daniel ; et al.	2020-12-17
Curing Pre-applied And Laser-ablated Underfill Via A Laser App 20200395503 - Wu; Jeb ; et al.	2020-12-17
Dielectric-dielectric And Metallization Bonding Via Plasma Activation And Laser-induced Heating App 20200395520 - Brodoceanu; Daniel ; et al.	2020-12-17
Bridge Pick-up Head For Transferring Semiconductor Devices App 20200343121 - Torrents Abad; Oscar ; et al.	2020-10-29
Rigid pickup head with conformable layer Grant 10,818,643 - Brodoceanu , et al. October 27, 2	2020-10-27

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