Seng; Eric Tan Swee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seng; Eric Tan Swee.The latest application filed is for "multi-chip modules including stacked semiconductor dice".

Company Profile

0.20.15

Seng; Eric Tan Swee - Singapore SG
Seng; Eric Tan Swee - SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip modules including stacked semiconductor dice Grant 11,101,245 - Seng August 24, 2	2021-08-24
Multi-chip Modules Including Stacked Semiconductor Dice App 20200365561 - Seng; Eric Tan Swee	2020-11-19
Semiconductor device assemblies including face-to-face semiconductor dice and related methods Grant 9,269,695 - Seng , et al. February 23, 2	2016-02-23
Multi-chip Modules Including Stacked Semiconductor Dice App 20150303176 - Seng; Eric Tan Swee	2015-10-22
Methods for forming assemblies and multi-chip modules including stacked semiconductor dice Grant 9,070,641 - Seng June 30, 2	2015-06-30
Semiconductor Device Assemblies Including Face-to-face Semiconductor Dice And Related Methods App 20150076679 - Seng; Eric Tan Swee ; et al.	2015-03-19
Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies Grant 8,384,200 - Seng , et al. February 26, 2	2013-02-26
Methods For Forming Assemblies And Multi Chip Modules Including Stacked Semiconductor Dice App 20120295401 - Seng; Eric Tan Swee	2012-11-22
Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads Grant 8,237,290 - Seng August 7, 2	2012-08-07
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components Grant 7,691,726 - Seng April 6, 2	2010-04-06
Assemblies And Multi Chip Modules Including Stacked Semiconductor Dice Having Centrally Located, Wire Bonded Bond Pads App 20090121338 - Seng; Eric Tan Swee	2009-05-14
Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2	2009-05-05
Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads Grant 7,492,039 - Seng February 17, 2	2009-02-17
Microelectronic Component Assemblies With Recessed Wire Bonds And Methods Of Making Same App 20080164591 - Seng; Eric Tan Swee ; et al.	2008-07-10
Invertible microfeature device packages Grant 7,368,810 - Seng , et al. May 6, 2	2008-05-06
Microelectronic component assemblies with recessed wire bonds and methods of making same Grant 7,365,424 - Seng , et al. April 29, 2	2008-04-29
Methods of forming a multi-chip module having discrete spacers Grant 7,276,790 - Seng October 2, 2	2007-10-02
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2	2007-09-25
Semiconductor device assemblies including face-to-face semiconductor dice, systems including such assemblies, and methods for fabricating such assemblies App 20070194415 - Seng; Eric Tan Swee ; et al.	2007-08-23
Invertible microfeature device packages Grant 7,259,451 - Seng , et al. August 21, 2	2007-08-21
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components Grant 7,218,001 - Seng May 15, 2	2007-05-15
Microelectronic component assemblies with recessed wire bonds and methods of making same App 20060208366 - Seng; Eric Tan Swee ; et al.	2006-09-21
Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ; et al.	2006-08-31
Invertible microfeature device packages and associated methods App 20060035503 - Seng; Eric Tan Swee ; et al.	2006-02-16
Microelectronic component assemblies with recessed wire bonds and methods of making same App 20060017177 - Seng; Eric Tan Swee ; et al.	2006-01-26
Packaged microelectronic component assemblies Grant 6,951,982 - Chye , et al. October 4, 2	2005-10-04
Packaged microelectronic devices and methods of forming same Grant 6,943,450 - Fee , et al. September 13, 2	2005-09-13
Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components App 20050093174 - Seng, Eric Tan Swee	2005-05-05
Packaged microelectronic devices and methods of forming same Grant 6,876,066 - Fee , et al. April 5, 2	2005-04-05
Invertible microfeature device packages and associated methods App 20050046000 - Seng, Eric Tan Swee ; et al.	2005-03-03
Packaged microelectronic devices and methods of forming same App 20050023655 - Fee, Setho Sing ; et al.	2005-02-03
Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ; et al.	2004-11-04
Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2	2004-06-08

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