| Patent | Date |
|---|
Semiconductor Packages With Embedded Interconnects
App 20220302005 - Lee; Kyu Oh ; et al. | 2022-09-22 |
Semiconductor packages with embedded interconnects
Grant 11,393,745 - Lee , et al. July 19, 2 | 2022-07-19 |
Package-integrated vertical capacitors and methods of assembling same
Grant 11,296,186 - Marin , et al. April 5, 2 | 2022-04-05 |
Embedded Die Microelectronic Device With Molded Component
App 20210366835 - Pietambaram; Srinivas Venkata Ramanuja ; et al. | 2021-11-25 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20210305668 - MARIN; Brandon C. ; et al. | 2021-09-30 |
Chemical Mechanical Polishing Using Fluorescence-based Endpoint Detection
App 20210260718 - Raghavan; Srini ; et al. | 2021-08-26 |
Fabricating an RF filter on a semiconductor package using selective seeding
Grant 11,081,768 - Marin , et al. August 3, 2 | 2021-08-03 |
Embedded die microelectronic device with molded component
Grant 11,081,448 - Pietambaram , et al. August 3, 2 | 2021-08-03 |
Electronic package that includes lamination layer
Grant 10,985,080 - Malatkar , et al. April 20, 2 | 2021-04-20 |
Semiconductor Packages With Embedded Interconnects
App 20210082797 - Lee; Kyu Oh ; et al. | 2021-03-18 |
Glass Dielectric Layer With Patterning
App 20210078296 - KONG; Jieying ; et al. | 2021-03-18 |
Fabricating An Rf Filter On A Semiconductor Package Using Selective Seeding
App 20200373261 - MARIN; Brandon C. ; et al. | 2020-11-26 |
Ultra-thin Dielectric Films Using Photo Up-conversion For Applications In Substrate Manufacturing And Integrating Passives
App 20200373157 - ECTON; Jeremy D. ; et al. | 2020-11-26 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20200350396 - Balasubramanian; Shivasubramanian ; et al. | 2020-11-05 |
Flexible packaging for a wearable electronic device
Grant 10,820,437 - Aleksov , et al. October 27, 2 | 2020-10-27 |
Method for making a flexible wearable circuit
Grant 10,798,817 - Aleksov , et al. October 6, 2 | 2020-10-06 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,756,161 - Balasubramanian , et al. A | 2020-08-25 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses
App 20200253037 - Kind Code | 2020-08-06 |
Package-integrated Vertical Capacitors And Methods Of Assembling Same
App 20200144359 - Marin; Brandon C. ; et al. | 2020-05-07 |
Surface Finishes With Low Rbtv For Fine And Mixed Bump Pitch Architectures
App 20200135679 - DARMAWAIKARTA; Kristof ; et al. | 2020-04-30 |
Selective Deposition Of Embedded Thin-film Resistors For Semiconductor Packaging
App 20200083164 - MARIN; Brandon C. ; et al. | 2020-03-12 |
Embedded circuit patterning feature selective electroless
Grant 10,586,715 - Li , et al. | 2020-03-10 |
Package-integrated vertical capacitors and methods of assembling same
Grant 10,546,916 - Marin , et al. Ja | 2020-01-28 |
Package-integrated Vertical Capacitors And Methods Of Assembling Same
App 20200006468 - Marin; Brandon C. ; et al. | 2020-01-02 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20200006463 - Balasubramanian; Shivasubramanian ; et al. | 2020-01-02 |
Dielectric Film With Pressure Sensitive Microcapsules Of Adhesion Promoter
App 20190389179 - AKKINEPALLY; Praneeth ; et al. | 2019-12-26 |
Embedded Die Microelectronic Device With Molded Component
App 20190333861 - Pietambaram; Srinivas V. ; et al. | 2019-10-31 |
Flexible Packaging For A Wearable Electronic Device
App 20190281717 - Aleksov; Aleksandar ; et al. | 2019-09-12 |
Stretchable electronic assembly
Grant 10,327,330 - Aleksov , et al. | 2019-06-18 |
Selective metallization of an integrated circuit (IC) substrate
Grant 10,290,557 - Marin , et al. | 2019-05-14 |
Bendable and stretchable electronic devices and methods
Grant 10,204,855 - Levander , et al. Feb | 2019-02-12 |
Dual-sided Package Assembly Processing
App 20190043776 - MALATKAR; Pramod ; et al. | 2019-02-07 |
Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics
App 20180376585 - Aleksov; Aleksandar ; et al. | 2018-12-27 |
Electronic Package That Includes Lamination Layer
App 20180350709 - Malatkar; Pramod ; et al. | 2018-12-06 |
Build-up high-aspect ratio opening
Grant 10,111,338 - Truong , et al. October 23, 2 | 2018-10-23 |
Flexible microelectronic systems and methods of fabricating the same
Grant 10,103,037 - Aleksov , et al. October 16, 2 | 2018-10-16 |
Stretchable Electronic Assembly
App 20180295720 - Aleksov; Aleksandar ; et al. | 2018-10-11 |
Build-up High-aspect Ratio Opening
App 20180270953 - Truong; Frank ; et al. | 2018-09-20 |
Raster-planarized substrate interlayers and methods of planarizing same
Grant 10,068,776 - Truong , et al. September 4, 2 | 2018-09-04 |
Formation of dielectric with smooth surface
Grant 10,070,537 - Arora , et al. September 4, 2 | 2018-09-04 |
Package with passivated interconnects
Grant 10,043,740 - Boyapati , et al. August 7, 2 | 2018-08-07 |
Selective Metallization Of An Integrated Circuit (ic) Substrate
App 20180033707 - MARIN; Brandon C. ; et al. | 2018-02-01 |
Package With Passivated Interconnects
App 20180019197 - BOYAPATI; SRI RANGA SAI ; et al. | 2018-01-18 |
Multilayer substrate for semiconductor packaging
Grant 9,788,416 - Jen , et al. October 10, 2 | 2017-10-10 |
Embeded Circuit Patterning Feature Selective Electroless Copper Plating
App 20170243762 - LI; Yonggang Yong ; et al. | 2017-08-24 |
Panel With Releasable Core
App 20170202080 - Shen; Ching-Ping Janet ; et al. | 2017-07-13 |
Embedded circuit patterning feature selective electroless copper plating
Grant 9,646,854 - Li , et al. May 9, 2 | 2017-05-09 |
Panel with releasable core
Grant 9,554,468 - Shen , et al. January 24, 2 | 2017-01-24 |
Panel with releasable core
Grant 9,554,472 - Shen , et al. January 24, 2 | 2017-01-24 |
Microelectronic Build-up Layers And Methods Of Forming The Same
App 20160374210 - MARIN; Brandon C. ; et al. | 2016-12-22 |
Multilayer Substrate For Semiconductor Packaging
App 20160329274 - Jen; Wei-Lun Kane ; et al. | 2016-11-10 |
Bendable And Stretchable Electronic Devices And Methods
App 20160284630 - Levander; Alejandro ; et al. | 2016-09-29 |
Embedded architecture using resin coated copper
Grant 9,451,696 - Seneviratne , et al. September 20, 2 | 2016-09-20 |
Formation Of Dielectric With Smooth Surface
App 20160192508 - Arora; Deepak ; et al. | 2016-06-30 |
Bumpless Build-up Layer Package Including A Release Layer
App 20160141265 - Jin; Liwen ; et al. | 2016-05-19 |
Bumpless build-up layer package including a release layer
Grant 9,320,149 - Jin , et al. April 19, 2 | 2016-04-19 |
Microelectronic Package And Stacked Microelectronic Assembly And Computing System Containing Same
App 20150340312 - Malatkar; Pramod ; et al. | 2015-11-26 |
Flexible Microelectronic Systems And Methods Of Fabricating The Same
App 20150325491 - Aleksov; Aleksandar ; et al. | 2015-11-12 |
Microelectronic package and stacked microelectronic assembly and computing system containing same
Grant 9,159,649 - Malatkar , et al. October 13, 2 | 2015-10-13 |
Embedded Circuit Patterningg Feature Selective Electroless Copper Plating
App 20150279731 - LI; Yonggang Yong ; et al. | 2015-10-01 |
Panel With Releasable Core
App 20150181713 - Shen; Ching-Ping Janet ; et al. | 2015-06-25 |
Panel With Releasable Core
App 20150181717 - Shen; Ching-Ping Janet ; et al. | 2015-06-25 |
Formation Of Dielectric With Smooth Surface
App 20140353019 - Arora; Deepak ; et al. | 2014-12-04 |
Bumpless Build-up Layer Package Including A Release Layer
App 20140177193 - Jin; Liwen ; et al. | 2014-06-26 |
Embedded Architecture Using Resin Coated Copper
App 20140090879 - SENEVIRATNE; Dilan ; et al. | 2014-04-03 |
Microelectronic Package And Stacked Microelectronic Assembly And Computing System Containing Same
App 20130270719 - Malatkar; Pramod ; et al. | 2013-10-17 |
Method Of Manufacturing A Substrate For A Microelectronic Device, And Substrate Formed Thereby
App 20110135883 - Jomaa; Houssam ; et al. | 2011-06-09 |
Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby
Grant 7,909,977 - Jomaa , et al. March 22, 2 | 2011-03-22 |
Method Of Manufacturing A Substrate For A Microelectronic Device, And Substrate Formed Thereby
App 20090246462 - Jomaa; Houssam ; et al. | 2009-10-01 |
Functional material for micro-mechanical systems
App 20060006484 - Seneviratne; Dilan ; et al. | 2006-01-12 |
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