loadpatents
name:-0.0098979473114014
name:-0.017120122909546
name:-0.00069284439086914
Sendai; Satoshi Patent Filings

Sendai; Satoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sendai; Satoshi.The latest application filed is for "plating apparatus and method".

Company Profile
0.10.7
  • Sendai; Satoshi - Tokyo JP
  • Sendai; Satoshi - Fujisawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plating apparatus and plating liquid removing method
Grant 7,241,372 - Sendai , et al. July 10, 2
2007-07-10
Plating apparatus and method
Grant 7,166,204 - Sendai , et al. January 23, 2
2007-01-23
Plating apparatus and method
App 20060185976 - Sendai; Satoshi ;   et al.
2006-08-24
Substrate plating method and apparatus
App 20060144714 - Hongo; Akihisa ;   et al.
2006-07-06
Substrate plating method and apparatus
Grant 7,033,463 - Hongo , et al. April 25, 2
2006-04-25
Substrate plating apparatus and method
Grant 6,793,794 - Hongo , et al. September 21, 2
2004-09-21
Plating apparatus and plating liquid removing method
App 20040129575 - Sendai, Satoshi ;   et al.
2004-07-08
Plating apparatus and method
App 20040089555 - Sendai, Satoshi ;   et al.
2004-05-13
Plating apparatus and plating liquid removing method
Grant 6,689,216 - Sendai , et al. February 10, 2
2004-02-10
Plating apparatus and method
Grant 6,660,139 - Sendai , et al. December 9, 2
2003-12-09
Method and apparatus for plating substrate and plating facility
Grant 6,558,518 - Sendai , et al. May 6, 2
2003-05-06
Plating apparatus and method
App 20030057098 - Sendai, Satoshi ;   et al.
2003-03-27
Plating device
Grant 6,517,689 - Hongo , et al. February 11, 2
2003-02-11
Substrate plating apparatus
App 20020139683 - Hongo, Akihisa ;   et al.
2002-10-03
Wafer plating jig
Grant 6,365,020 - Yoshioka , et al. April 2, 2
2002-04-02
Plating apparatus and plating liquid removing method
App 20020017465 - Sendai, Satoshi ;   et al.
2002-02-14
Electroconductive composite ceramics
Grant 4,110,260 - Yamamoto , et al. August 29, 1
1978-08-29

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