loadpatents
name:-0.019249200820923
name:-0.016674041748047
name:-0.0012669563293457
Senda; Takeshi Patent Filings

Senda; Takeshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Senda; Takeshi.The latest application filed is for "silicon wafer and method for manufacturing the same".

Company Profile
0.16.17
  • Senda; Takeshi - Niigata JP
  • Senda; Takeshi - Tokyo JP
  • Senda; Takeshi - Kitakanbara-gun JP
  • Senda; Takeshi - Shibata JP
  • Senda; Takeshi - Kitakanbaragun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicon wafer and method for manufacturing the same
Grant 10,141,180 - Araki , et al. Nov
2018-11-27
Laser joining method
Grant 9,421,712 - Arai , et al. August 23, 2
2016-08-23
Thermal treatment method of silicon wafer and silicon wafer
Grant 9,059,099 - Senda , et al. June 16, 2
2015-06-16
Silicon wafer and method for heat-treating silicon wafer
Grant 8,999,864 - Senda , et al. April 7, 2
2015-04-07
Silicon Wafer And Method For Manufacturing The Same
App 20150044422 - ARAKI; Koji ;   et al.
2015-02-12
Laser Joining Method
App 20140332157 - Arai; Satoshi ;   et al.
2014-11-13
Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process
Grant 8,476,149 - Isogai , et al. July 2, 2
2013-07-02
Method For Heat-treating Silicon Wafer
App 20130078588 - Senda; Takeshi ;   et al.
2013-03-28
Method for heat treating a silicon wafer
Grant 8,399,341 - Senda , et al. March 19, 2
2013-03-19
Thermal Treatment Method Of Silicon Wafer And Silicon Wafer
App 20120241912 - SENDA; Takeshi ;   et al.
2012-09-27
Method of heat treating silicon wafer
Grant 8,252,700 - Senda , et al. August 28, 2
2012-08-28
Method For Heat Treating A Silicon Wafer
App 20120184091 - Senda; Takeshi ;   et al.
2012-07-19
Silicon Wafer And Method For Heat-treating Silicon Wafer
App 20120139088 - Senda; Takeshi ;   et al.
2012-06-07
Manufacturing method for silicon wafer
Grant 7,977,219 - Isogai , et al. July 12, 2
2011-07-12
Method of heat treating silicon wafer
App 20100197146 - Senda; Takeshi ;   et al.
2010-08-05
Surface inspection apparatus and surface inspection method for strained silicon wafer
Grant 7,679,730 - Takano , et al. March 16, 2
2010-03-16
Manufacturing Method For Silicon Wafer
App 20100055884 - Isogai; Hiromichi ;   et al.
2010-03-04
Silicon Wafer, Method For Manufacturing The Same And Method For Heat-treating The Same
App 20100038757 - Isogai; Hiromichi ;   et al.
2010-02-18
Method Of Manufacturing Semiconductor Substrate
App 20090004825 - SENDA; Takeshi ;   et al.
2009-01-01
Semiconductor Substrate And Manufacturing Method Thereof
App 20080164572 - Toyoda; Eiji ;   et al.
2008-07-10
Silicon Wafer
App 20070240628 - Watanabe; Takashi ;   et al.
2007-10-18
Manufacturing method for strained silicon wafer
Grant 7,250,357 - Senda , et al. July 31, 2
2007-07-31
Manufacturing method for strained silicon wafer
Grant 7,247,583 - Kurita , et al. July 24, 2
2007-07-24
Method of manufacturing silicon wafer
App 20070068447 - Izunome; Koji ;   et al.
2007-03-29
Manufacturing method for a silicon substrate having strained layer
Grant 7,060,597 - Kurita , et al. June 13, 2
2006-06-13
Manufacturing method for strained silicon wafer
App 20060057856 - Senda; Takeshi ;   et al.
2006-03-16
Manufacturing method for strained silicon wafer
App 20050170664 - Kurita, Hisatsugu ;   et al.
2005-08-04
Manufacturing method for a silicon substrate having strained layer
App 20040235274 - Kurita, Hisatsugu ;   et al.
2004-11-25

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