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Patent applications and USPTO patent grants for Senda; Hidemi.The latest application filed is for "inspection method for semiconductor substrate, manufacturing method of semiconductor device and inspection device for semiconductor substrate".
Patent | Date |
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Inspection method for semiconductor substrate, manufacturing method of semiconductor device and inspection device for semiconductor substrate Grant 9,753,082 - Iwahashi , et al. September 5, 2 | 2017-09-05 |
Inspection Method For Semiconductor Substrate, Manufacturing Method Of Semiconductor Device And Inspection Device For Semiconductor Substrate App 20160252571 - Iwahashi; Yohei ;   et al. | 2016-09-01 |
Mechanical Quantity Detecting Element And Mechanical Quantity Detecting Device App 20070126415 - SENDA; Hidemi | 2007-06-07 |
Sensing device and sensor apparatus Grant 6,568,267 - Chida , et al. May 27, 2 | 2003-05-27 |
Sensing device and sensor apparatus App 20010045127 - Chida, Kazumi ;   et al. | 2001-11-29 |
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