Senba; Naoji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Senba; Naoji.The latest application filed is for "double side connected type semiconductor apparatus".

Company Profile

0.13.10

Senba; Naoji - Tokyo JP
Senba, Naoji - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device assembly and a method of connecting electronic devices constituting the same Grant 6,798,070 - Funaya , et al. September 28, 2	2004-09-28
Method for making a bump structure Grant 6,625,883 - Soejima , et al. September 30, 2	2003-09-30
Double side connected type semiconductor apparatus App 20030127724 - Senba, Naoji	2003-07-10
Semiconductor manufacturing apparatus and method, semiconductor device and electronic device App 20030085256 - Senba, Naoji ; et al.	2003-05-08
Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied thereto App 20020056922 - Funaya, Takuo ; et al.	2002-05-16
Electronic device assembly and a method of connecting electronic devices constituting the same App 20020042164 - Funaya, Takuo ; et al.	2002-04-11
Bump structure and method for making the same App 20020038509 - Soejima, Koji ; et al.	2002-04-04
Three-dimensional semiconductor device and method of manufacturing the same App 20020022303 - Senba, Naoji ; et al.	2002-02-21
Semiconductor device and method of fabricating the same App 20010054762 - Yamazaki, Takao ; et al.	2001-12-27
Function element, substrate for mounting function element thereon, and method of connecting them to each other Grant 6,313,533 - Funaya , et al. November 6, 2	2001-11-06
Probe card and method of forming a probe card Grant 6,307,392 - Soejima , et al. October 23, 2	2001-10-23
Apparatus for transferring micro-balls App 20010015372 - Yamamoto, Takumi ; et al.	2001-08-23
Method and apparatus for lining up micro-balls App 20010009261 - Yamamoto, Takumi ; et al.	2001-07-26
Electronic device assembly and a method of connecting electronic devices constituting the same App 20010003656 - Funaya, Takuo ; et al.	2001-06-14
Semiconductor packing stack module and method of producing the same Grant 6,188,127 - Senba , et al. February 13, 2	2001-02-13
Probe card with plural probe tips on a unitary flexible tongue Grant 6,114,864 - Soejima , et al. September 5, 2	2000-09-05
Solder ball arrangement device Grant 6,095,398 - Takahashi , et al. August 1, 2	2000-08-01
Method for arranging minute metallic balls Grant 5,976,965 - Takahashi , et al. November 2, 1	1999-11-02
Stacked carrier three-dimensional memory module and semiconductor device using the same Grant 5,973,392 - Senba , et al. October 26, 1	1999-10-26
Stack module Grant 5,883,426 - Tokuno , et al. March 16, 1	1999-03-16
Semiconductor device and method of fabricating the same Grant 5,793,117 - Shimada , et al. August 11, 1	1998-08-11
Sealing structure for bumps on a semiconductor integrated circuit chip Grant 5,600,180 - Kusaka , et al. February 4, 1	1997-02-04
Multi-level wiring structure having an organic interlayer insulating film Grant 5,310,965 - Senba , et al. May 10, 1	1994-05-10

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