Sen; Amlan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sen; Amlan.The latest application filed is for "plating apparatus and operation method thereof".

Company Profile

7.7.16

Sen; Amlan - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Panel level packaging for devices Grant 11,456,259 - Sen September 27, 2	2022-09-27
Plating Apparatus And Operation Method Thereof App 20220178044 - SEN; Amlan ; et al.	2022-06-09
Apparatus And Method For Bonding A Plurality Of Dies To A Carrier Panel App 20220102189 - CHEW; HWEE SENG ; et al.	2022-03-31
Plating apparatus and operation method thereof Grant 11,261,535 - Sen , et al. March 1, 2	2022-03-01
Precision Reconstruction For Panel-level Packaging App 20220028703 - Sen; Amlan ; et al.	2022-01-27
Automation line for processing a molded panel Grant 11,107,716 - Sen August 31, 2	2021-08-31
Automation Line For Processing A Molded Panel App 20210249290 - SEN; AMLAN	2021-08-12
Post Bond Inspection Of Devices For Panel Packaging App 20210118841 - SEN; Amlan ; et al.	2021-04-22
Wetting Processing Apparatus And Operation Method Thereof App 20210111045 - SEN; Amlan ; et al.	2021-04-15
Panel Level Packaging For Devices App 20200312780 - Sen; Amlan	2020-10-01
Compression Molding Machine And Method Of Compression Molding App 20200307037 - SEN; AMLAN	2020-10-01
Plating Apparatus And Operation Method Thereof App 20200299854 - SEN; Amlan ; et al.	2020-09-24
Apparatus And Method For Semiconductor Device Bonding App 20200083193 - SEN; Amlan	2020-03-12
Substrate For Semiconductor Packaging And Method Of Forming Same App 20150348895 - SEN; Amlan ; et al.	2015-12-03
Method for device packaging Grant 9,120,169 - Chew , et al. September 1, 2	2015-09-01
System for encapsulation of semiconductor dies Grant 9,082,775 - Sen , et al. July 14, 2	2015-07-14
Method And Systems For Semiconductor Chip Pick & Transfer And Bonding App 20140154037 - Sen; Amlan	2014-06-05
In-situ Melt And Reflow Process For Forming Flip-chip Interconnections And Systems Thereof App 20110287560 - Chew; Hwee Seng ; et al.	2011-11-24
Method For Encapsulating Semiconductor Dies App 20110281403 - Sen; Amlan ; et al.	2011-11-17
System For Encapsulation Of Semiconductor Dies App 20110271902 - Sen; Amlan ; et al.	2011-11-10

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