SEMIgear, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SEMIgear, Inc..The latest application filed is for "apparatus and method for cooling substrate".

Company Profile

14.28.23

SEMIgear, Inc. - Wakefield MA US
Semigear, Inc - Wakefield MA
Semigear Inc. - Woburn MA
Semigear Inc -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for cooling substrate Grant 11,456,192 - Kim , et al. September 27, 2	2022-09-27
Substrate pressing module, substrate pressing method, substrate treating apparatus including the substrate treating module, and the substrate treating method Grant 11,315,807 - Lee , et al. April 26, 2	2022-04-26
Device packaging facility and method, and device processing apparatus utilizing DEHT Grant 10,937,757 - Zhang , et al. March 2, 2	2021-03-02
Apparatus And Method For Cooling Substrate App 20210035828 - KIM; Jonghoon ; et al.	2021-02-04
Substrate support unit Grant 10,861,735 - Heo , et al. December 8, 2	2020-12-08
Alignment apparatus Grant 10,790,179 - Lee , et al. September 29, 2	2020-09-29
Alignment Apparatus App 20190378738 - LEE; Seockhwi ; et al.	2019-12-12
Substrate Pressing Module, Substrate Pressing Method, Substrate Treating Apparatus Including The Substrate Treating Module, And App 20190348308 - LEE; Suncheol ; et al.	2019-11-14
Substrate Support Unit App 20190333800 - HEO; Yonghoe ; et al.	2019-10-31
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Deht App 20190229086 - ZHANG; Jian ; et al.	2019-07-25
Device packaging facility and method, and device processing apparatus utilizing DEHT Grant 10,283,481 - Zhang , et al.	2019-05-07
Device packaging facility and method, and device processing apparatus utilizing DEHT Grant 9,824,998 - Zhang , et al. November 21, 2	2017-11-21
Device packaging facility and method, and device processing apparatus utilizing phthalate Grant 9,741,683 - Zhang , et al. August 22, 2	2017-08-22
Reflow treating unit and substrate treating apparatus Grant 9,629,258 - Zhang April 18, 2	2017-04-18
Reflow treating unit and substrate treating apparatus Grant 9,572,266 - Zhang February 14, 2	2017-02-14
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Deht App 20160336293 - ZHANG; Jian ; et al.	2016-11-17
Device packaging facility and method, and device processing apparatus utilizing phthalate Grant 9,472,531 - Zhang , et al. October 18, 2	2016-10-18
Device Packaging Facility And Method, And Device Processing Apparatus Utilizing Phthalate App 20160233191 - ZHANG; Jian ; et al.	2016-08-11
Reflow Treating Unit and Substrate Treating Apparatus App 20160143155 - ZHANG; Jian	2016-05-19
Reflow treating unit and substrate treating apparatus App 20160143156 - Zhang; Jian	2016-05-19
Reflow treating unit and substrate treating apparatus Grant 9,226,407 - Zhang December 29, 2	2015-12-29
Reflow treating unit & substrate treating apparatus App 20150034699 - Zhang; Jian	2015-02-05
Reflow treating unit & substrate treating apparatus App 20150034700 - Zhang; Jian	2015-02-05
Apparatus & method for treating substrate App 20150034702 - Zhang; Jian	2015-02-05
Arrangement for solder bump formation on wafers Grant 8,524,593 - Lee , et al. September 3, 2	2013-09-03
Flux-free chip to substrate joint serial linear thermal processor arrangement Grant 8,274,161 - Zhang , et al. September 25, 2	2012-09-25
Flux-free chip to wafer joint serial thermal processor arrangement Grant 8,252,678 - Zhang August 28, 2	2012-08-28
Flux-free chip to wafer joint serial thermal processor arrangement App 20110198388 - Zhang; Jian	2011-08-18
Arrangement for solder bump formation on wafers Grant 7,982,320 - Lee , et al. July 19, 2	2011-07-19
Arrangement for solder bump formation on wafers Grant 7,632,750 - Lee , et al. December 15, 2	2009-12-15
Arrangement for solder bump formation on wafers App 20080009122 - Lee; Chunghsin ; et al.	2008-01-10
Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry Grant 7,008,879 - Lee , et al. March 7, 2	2006-03-07
Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry Grant 6,827,789 - Lee , et al. December 7, 2	2004-12-07

Company Registrations

SEC

0001214175

SEMIGEAR INC

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.