Seman; Andrew M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seman; Andrew M..The latest application filed is for "method of making a circuitized substrate".
- Seman; Andrew M. - Kirkwood NY
| Patent | Date |
|---|---|
| Method of making a circuitized substrate Grant 7,596,862 - Egitto , et al. October 6, 2 | 2009-10-06 |
| Method of making a circuitized substrate Grant 7,325,299 - Egitto , et al. February 5, 2 | 2008-02-05 |
| Method Of Making A Circuitized Substrate App 20080014409 - Egitto; Frank D. ; et al. | 2008-01-17 |
| Method Of Making A Circuitized Substrate App 20070102396 - Egitto; Frank D. ; et al. | 2007-05-10 |
| Method of making a circuitized substrate Grant 7,185,428 - Egitto , et al. March 6, 2 | 2007-03-06 |
| Method of fabricating printed circuit board with mixed metallurgy pads Grant 6,931,722 - Arrington , et al. August 23, 2 | 2005-08-23 |
| Fine line circuitization Grant 6,822,332 - Egitto , et al. November 23, 2 | 2004-11-23 |
| Fine line circuitization App 20040130003 - Egitto, Frank D. ; et al. | 2004-07-08 |
| Fine line circuitization App 20040056330 - Egitto, Frank D. ; et al. | 2004-03-25 |
| Printed circuit board with mixed metallurgy pads and method of fabrication App 20030177635 - Arrington, Edward L. ; et al. | 2003-09-25 |
| Printed circuit board with mixed metallurgy pads and method of fabrication App 20020157861 - Arrington, Edward L. ; et al. | 2002-10-31 |
| Electrical and/or thermal interconnections and methods for obtaining such Grant 5,189,261 - Alexander , et al. February 23, 1 | 1993-02-23 |
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