Sekowski; Daniel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sekowski; Daniel.The latest application filed is for "electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board".

Company Profile

0.7.6

Sekowski; Daniel - Lafayette IN
Sekowski; Daniel - Loganville GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board Grant 9,105,819 - Sekowski , et al. August 11, 2	2015-08-11
Electronic Apparatus Having An Encapsulating Layer Within And Outside Of A Molded Frame Overlying A Connection Arrangement On A Circuit Board App 20130236995 - Sekowski; Daniel ; et al.	2013-09-12
Lighting apparatus with several light units arranged in a heatsink Grant 8,348,460 - Bachl , et al. January 8, 2	2013-01-08
Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board Grant 8,184,440 - Sekowski , et al. May 22, 2	2012-05-22
LED assembly Grant 8,157,419 - Hand , et al. April 17, 2	2012-04-17
Light emitting diode arrangement for high safety requirements Grant 8,093,609 - Hand , et al. January 10, 2	2012-01-10
Led Assembly App 20110051423 - Hand; Mark Anthony ; et al.	2011-03-03
Luminaire Grant D632,830 - Sekowski , et al. February 15, 2	2011-02-15
Light Emitting Diode Arrangement for High Safety Requirements App 20100276711 - Hand; Mark Anthony ; et al.	2010-11-04
Electronic Apparatus App 20100277921 - Sekowski; Daniel ; et al.	2010-11-04
Lighting Apparatus with Several Light Units Arranged in a Heatsink App 20100277914 - Bachl; Bernhard ; et al.	2010-11-04

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