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name:-0.0048589706420898
name:-0.00044393539428711
Seko; Koichi Patent Filings

Seko; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seko; Koichi.The latest application filed is for "semiconductor device including heat dissipating structure".

Company Profile
0.4.6
  • Seko; Koichi - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device including heat dissipating structure
Grant 9,219,021 - Seko , et al. December 22, 2
2015-12-22
Semiconductor Device Including Heat Dissipating Structure
App 20150084180 - SEKO; Koichi ;   et al.
2015-03-26
Semiconductor device comprising an extended semiconductor chip having an extension
Grant 8,866,284 - Kobayashi , et al. October 21, 2
2014-10-21
Semiconductor Device
App 20130299957 - KOBAYASHI; SHOUICHI ;   et al.
2013-11-14
Method For Designing Electronic System
App 20110210453 - KUSUMOTO; Keiichi ;   et al.
2011-09-01
Method Of Designing Semiconductor Integrated Circuit, Designing Apparatus, Semiconductor Integrated Circuit System, Semiconductor Integrated Circuit Mounting Substrate, Package And Semiconductor Integrated Circuit
App 20110012260 - TOKUNAGA; Shinya ;   et al.
2011-01-20
Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
Grant 7,831,949 - Tokunaga , et al. November 9, 2
2010-11-09
Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same
Grant 7,565,637 - Seko , et al. July 21, 2
2009-07-21
Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
App 20080022252 - Tokunaga; Shinya ;   et al.
2008-01-24
Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same
App 20070105271 - Seko; Koichi ;   et al.
2007-05-10

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