SEKIYA; Kazuma
Patent Applications and Registrations
Patent applications and USPTO patent grants for SEKIYA; Kazuma.The latest application filed is for "method of manufacturing wafer and method of manufacturing stacked device chip".
Company Profile
51.134.195
- SEKIYA; Kazuma - Tokyo JP
- Sekiya; Kazuma - Ota-Ku N/A JP
Patent Activity
| Patent | Date |
|---|---|
| Method Of Manufacturing Wafer And Method Of Manufacturing Stacked Device Chip App 20220293424 - SEKIYA; Kazuma | 2022-09-15 |
| Cutting apparatus Grant 11,389,920 - Sekiya July 19, 2 | 2022-07-19 |
| Grinding Apparatus And Method Of Driving Grinding Apparatus App 20220193861 - SEKIYA; Kazuma | 2022-06-23 |
| Cutting apparatus Grant 11,351,651 - Sekiya June 7, 2 | 2022-06-07 |
| Method of processing wafer Grant 11,276,588 - Sekiya March 15, 2 | 2022-03-15 |
| Processing Method Of Wafer, Protective Sheet, And Protective Sheet Laying Method App 20220037160 - SEKIYA; Kazuma | 2022-02-03 |
| Wafer, Wafer Manufacturing Method, And Device Chip Manufacturing Method App 20220032404 - SEKIYA; Kazuma | 2022-02-03 |
| Wafer processing method Grant 11,222,823 - Sekiya January 11, 2 | 2022-01-11 |
| Management Method of processing tool Grant 11,188,050 - Sekiya November 30, 2 | 2021-11-30 |
| Dressing Member App 20210362295 - SEKIYA; Kazuma | 2021-11-25 |
| Cutting blade and mounting mechanism for cutting blade Grant 11,167,393 - Sekiya , et al. November 9, 2 | 2021-11-09 |
| Management Method Of Machining System App 20210339358 - SEKIYA; Kazuma | 2021-11-04 |
| Wet Etching Method And Wet Etching System App 20210335620 - SEKIYA; Kazuma ; et al. | 2021-10-28 |
| Cutting blade supplying apparatus and cutting blade case Grant 11,148,243 - Sekiya October 19, 2 | 2021-10-19 |
| Cutting Apparatus, Tray, And Transport System App 20210316411 - SEKIYA; Kazuma | 2021-10-14 |
| Recess or through-hole forming method and electrode forming method Grant 11,110,549 - Sekiya , et al. September 7, 2 | 2021-09-07 |
| Chuck table, cutting apparatus, and method correcting chuck table Grant 11,101,162 - Yamamoto , et al. August 24, 2 | 2021-08-24 |
| Method of manufacturing packaged board Grant 11,096,287 - Sekiya August 17, 2 | 2021-08-17 |
| Wafer and wafer producing method Grant 11,072,042 - Sekiya July 27, 2 | 2021-07-27 |
| Conveyance system Grant 11,059,673 - Sekiya July 13, 2 | 2021-07-13 |
| Protective member forming method Grant 11,056,374 - Sekiya July 6, 2 | 2021-07-06 |
| Protective Sheet Application Apparatus And Method App 20210197537 - SEKIYA; Kazuma | 2021-07-01 |
| Management system for supervising operator Grant 11,036,972 - Sekiya June 15, 2 | 2021-06-15 |
| Self-powered Water Leakage Detector App 20210172823 - SEKIYA; Kazuma | 2021-06-10 |
| SiC substrate processing method Grant 11,018,059 - Sekiya May 25, 2 | 2021-05-25 |
| Cutting apparatus Grant 11,011,393 - Sekiya May 18, 2 | 2021-05-18 |
| Method Of Processing Wafer App 20210134619 - SEKIYA; Kazuma | 2021-05-06 |
| Automated workpiece conveying vehicle Grant 10,974,359 - Sekiya April 13, 2 | 2021-04-13 |
| Cutting blade mounting mechanism Grant 10,974,364 - Sekiya April 13, 2 | 2021-04-13 |
| Wafer holding apparatus and wafer processing method using the same Grant 10,971,350 - Sekiya April 6, 2 | 2021-04-06 |
| Conveyance system Grant 10,964,571 - Sekiya March 30, 2 | 2021-03-30 |
| Conveyance system Grant 10,964,572 - Sekiya March 30, 2 | 2021-03-30 |
| Processing apparatus Grant 10,964,567 - Sekiya March 30, 2 | 2021-03-30 |
| Installation method of solar panel and solar panel Grant 10,938,339 - Sekiya March 2, 2 | 2021-03-02 |
| SiC substrate processing method Grant 10,930,561 - Sekiya February 23, 2 | 2021-02-23 |
| Wafer uniting method Grant 10,916,466 - Sekiya February 9, 2 | 2021-02-09 |
| Conveyance System App 20210024294 - SEKIYA; Kazuma | 2021-01-28 |
| Tape Attaching Method App 20200399089 - SEKIYA; Kazuma | 2020-12-24 |
| Tape attaching method and tape attaching apparatus Grant 10,872,791 - Sekiya December 22, 2 | 2020-12-22 |
| Chuck table and processing apparatus including the same Grant 10,870,220 - Sekiya December 22, 2 | 2020-12-22 |
| Grinding Apparatus And Use Method Of Grinding Apparatus App 20200391337 - TABUCHI; Tomotaka ; et al. | 2020-12-17 |
| Wafer processing method Grant 10,854,462 - Sekiya December 1, 2 | 2020-12-01 |
| Chuck table correction method and cutting apparatus Grant 10,847,398 - Sekiya November 24, 2 | 2020-11-24 |
| Cutting blade supplying apparatus Grant 10,843,304 - Sekiya November 24, 2 | 2020-11-24 |
| Chuck table mechanism Grant 10,843,313 - Sekiya November 24, 2 | 2020-11-24 |
| Method of manufacturing surface acoustic wave device chips Grant 10,826,456 - Sekiya November 3, 2 | 2020-11-03 |
| Conveyance System App 20200343111 - SEKIYA; Kazuma | 2020-10-29 |
| Method of laser-processing device wafer Grant 10,818,546 - Sekiya October 27, 2 | 2020-10-27 |
| Screwdriver App 20200331128 - SEKIYA; Kazuma | 2020-10-22 |
| Measuring instrument and processing apparatus Grant 10,809,105 - Sekiya October 20, 2 | 2020-10-20 |
| Laser Processing Apparatus App 20200324369 - SEKIYA; Kazuma | 2020-10-15 |
| Conveyance System App 20200312688 - SEKIYA; Kazuma | 2020-10-01 |
| Information transfer mechanism for processing apparatus for displaying notice information to an operator Grant 10,782,530 - Sekiya Sept | 2020-09-22 |
| Cutting blade mounting method Grant 10,759,088 - Sekiya Sep | 2020-09-01 |
| Method of processing wafer Grant 10,763,172 - Sekiya Sep | 2020-09-01 |
| Wafer Processing Method App 20200266103 - Sekiya; Kazuma | 2020-08-20 |
| Conveyance system Grant 10,717,605 - Sekiya | 2020-07-21 |
| Wafer And Wafer Producing Method App 20200223015 - SEKIYA; Kazuma | 2020-07-16 |
| Cutting Blade Mounting Method App 20200198183 - Sekiya; Kazuma | 2020-06-25 |
| Wafer processing method including cutting wafer based on surface height of wafer Grant 10,692,767 - Sekiya | 2020-06-23 |
| Method of using laminated dressing board Grant 10,668,595 - Sekiya | 2020-06-02 |
| Protective Member Forming Method App 20200135531 - SEKIYA; Kazuma | 2020-04-30 |
| Wafer Holding Apparatus And Wafer Processing Method Using The Same App 20200118863 - SEKIYA; Kazuma | 2020-04-16 |
| SiC SUBSTRATE PROCESSING METHOD App 20200075415 - SEKIYA; Kazuma | 2020-03-05 |
| Remote Control Switch For Electrical Equipment App 20200074845 - SEKIYA; Kazuma | 2020-03-05 |
| SiC SUBSTRATE PROCESSING METHOD App 20200075414 - SEKIYA; Kazuma | 2020-03-05 |
| Dressing board, cutting blade dressing method, and cutting apparatus Grant 10,576,608 - Sekiya | 2020-03-03 |
| Cutting blade mounting mechanism Grant 10,569,442 - Sekiya Feb | 2020-02-25 |
| Wafer Uniting Method App 20200058537 - SEKIYA; Kazuma | 2020-02-20 |
| Cutting Apparatus App 20200058524 - SEKIYA; Kazuma | 2020-02-20 |
| Wafer processing method Grant 10,562,207 - Sekiya , et al. Feb | 2020-02-18 |
| Automated Workpiece Conveying Vehicle App 20200023484 - SEKIYA; Kazuma | 2020-01-23 |
| Processing apparatus and processing method for workpiece Grant 10,532,445 - Sekiya Ja | 2020-01-14 |
| Method of manufacturing stacked wafer assembly Grant 10,522,503 - Sekiya Dec | 2019-12-31 |
| Human resources management system Grant 10,515,421 - Sekiya Dec | 2019-12-24 |
| Conveyance System App 20190352099 - SEKIYA; Kazuma | 2019-11-21 |
| Management System For Supervising Operator App 20190354751 - SEKIYA; Kazuma | 2019-11-21 |
| Chip accommodation tray Grant 10,475,681 - Sekiya Nov | 2019-11-12 |
| Liquid container and liquid supply apparatus Grant 10,464,329 - Sekiya No | 2019-11-05 |
| Wafer processing method and adhesive tape Grant 10,460,974 - Sekiya Oc | 2019-10-29 |
| Processing Apparatus App 20190318953 - SEKIYA; Kazuma | 2019-10-17 |
| Wafer processing method and cutting apparatus Grant 10,446,403 - Sekiya Oc | 2019-10-15 |
| Chuck Table And Processing Apparatus Including The Same App 20190275700 - SEKIYA; Kazuma | 2019-09-12 |
| Chuck Table, Cutting Apparatus, And Method Correcting Chuck Table App 20190273010 - YAMAMOTO; Setsuo ; et al. | 2019-09-05 |
| Wafer processing method Grant 10,403,490 - Sekiya Sep | 2019-09-03 |
| Tape Attaching Method And Tape Attaching Apparatus App 20190267264 - SEKIYA; Kazuma | 2019-08-29 |
| Human transporting drone Grant 10,358,217 - Sekiya July 23, 2 | 2019-07-23 |
| Method Of Manufacturing Packaged Board App 20190215966 - SEKIYA; Kazuma | 2019-07-11 |
| Method Of Processing Wafer App 20190206734 - Sekiya; Kazuma | 2019-07-04 |
| Chuck Table Correction Method And Cutting Apparatus App 20190198379 - SEKIYA; Kazuma | 2019-06-27 |
| Recess Or Through-hole Forming Method And Electrode Forming Method App 20190193205 - SEKIYA; Kazuma ; et al. | 2019-06-27 |
| Grinding apparatus and wafer processing method Grant 10,328,547 - Sekiya | 2019-06-25 |
| Wafer processing method Grant 10,332,777 - Sekiya | 2019-06-25 |
| Workpiece Processing Method App 20190189497 - SEKIYA; Kazuma | 2019-06-20 |
| Wafer processing method Grant 10,312,099 - Sekiya , et al. | 2019-06-04 |
| Wafer Processing Method App 20190157151 - SEKIYA; Kazuma | 2019-05-23 |
| Cutting Apparatus App 20190143480 - SEKIYA; Kazuma | 2019-05-16 |
| Die Bonding Resin Layer Forming Apparatus App 20190139928 - SEKIYA; Kazuma | 2019-05-09 |
| Chuck Table Mechanism App 20190111547 - SEKIYA; Kazuma | 2019-04-18 |
| Installation Method Of Solar Panel And Solar Panel App 20190089297 - Sekiya; Kazuma | 2019-03-21 |
| Cutting Blade Mounting Mechanism App 20190084124 - Sekiya; Kazuma | 2019-03-21 |
| Cutting Blade Mounting Mechanism App 20190084175 - Sekiya; Kazuma | 2019-03-21 |
| Cutting Apparatus App 20190076981 - Sekiya; Kazuma | 2019-03-14 |
| Method Of Manufacturing Stacked Wafer Assembly App 20190081021 - Sekiya; Kazuma | 2019-03-14 |
| Cutting Blade Supplying Apparatus App 20190070700 - Sekiya; Kazuma | 2019-03-07 |
| Cutting Blade Supplying Apparatus And Cutting Blade Case App 20190070701 - Sekiya; Kazuma | 2019-03-07 |
| Dressing Board, Use Method Of Dressing Board, And Cutting Apparatus App 20190061093 - Sekiya; Kazuma | 2019-02-28 |
| Cutting Blade And Mounting Mechanism For Cutting Blade App 20190054596 - Sekiya; Kazuma ; et al. | 2019-02-21 |
| Silicon Wafer Forming Method App 20190039187 - Sekiya; Kazuma | 2019-02-07 |
| Information Transfer Mechanism For Processing Apparatus App 20190041647 - Sekiya; Kazuma | 2019-02-07 |
| Wafer Producing Method And Wafer Producing Apparatus App 20190030651 - Sekiya; Kazuma | 2019-01-31 |
| Measuring Instrument And Processing Apparatus App 20190011298 - Sekiya; Kazuma | 2019-01-10 |
| Method of sorting chips Grant 10,175,204 - Sekiya , et al. J | 2019-01-08 |
| Wafer processing method Grant 10,177,034 - Sekiya J | 2019-01-08 |
| Cutting Blade Mounting Method App 20190001526 - Sekiya; Kazuma | 2019-01-03 |
| Wafer processing system Grant 10,170,379 - Sekiya J | 2019-01-01 |
| Liquid Container And Liquid Supply Apparatus App 20180361749 - Sekiya; Kazuma | 2018-12-20 |
| Processing Apparatus App 20180358250 - Sekiya; Kazuma | 2018-12-13 |
| Processing apparatus Grant 10,153,836 - Sekiya Dec | 2018-12-11 |
| Method for inspecting cutting blade Grant 10,150,198 - Sekiya Dec | 2018-12-11 |
| Wafer Processing Method App 20180342398 - Sekiya; Kazuma | 2018-11-29 |
| Wafer Processing Method App 20180330938 - Sekiya; Kazuma | 2018-11-15 |
| Wafer Processing Method App 20180330978 - Sekiya; Kazuma | 2018-11-15 |
| Wafer Processing Method App 20180315610 - Sekiya; Kazuma ; et al. | 2018-11-01 |
| Small unmanned air vehicle repulsing apparatus Grant 10,113,839 - Sekiya October 30, 2 | 2018-10-30 |
| Management Method Of Processing Tool App 20180307199 - Sekiya; Kazuma | 2018-10-25 |
| LED assembling method Grant 10,109,765 - Sekiya October 23, 2 | 2018-10-23 |
| Wafer processing method Grant 10,109,528 - Sekiya October 23, 2 | 2018-10-23 |
| Electric vehicle and equipment therefor Grant 10,071,638 - Sekiya September 11, 2 | 2018-09-11 |
| Workpiece processing method Grant 10,056,296 - Sekiya August 21, 2 | 2018-08-21 |
| Semiconductor wafer Grant 10,056,246 - Sekiya August 21, 2 | 2018-08-21 |
| Wafer Processing Method App 20180229396 - Sekiya; Kazuma ; et al. | 2018-08-16 |
| Method Of Using Laminated Dressing Board App 20180215010 - Sekiya; Kazuma | 2018-08-02 |
| Frame unit transfer system Grant 10,037,907 - Sekiya July 31, 2 | 2018-07-31 |
| Frame Unit Transfer System App 20180204752 - Sekiya; Kazuma | 2018-07-19 |
| Dressing Board, Cutting Blade Dressing Method, And Cutting Apparatus App 20180200866 - Sekiya; Kazuma | 2018-07-19 |
| Manufacturing Method For Package Device App 20180204818 - Sekiya; Kazuma | 2018-07-19 |
| Wafer Processing Method And Adhesive Tape App 20180197765 - Sekiya; Kazuma | 2018-07-12 |
| Led Assembling Method App 20180151773 - Sekiya; Kazuma | 2018-05-31 |
| Personnel Management System App 20180130005 - Sekiya; Kazuma | 2018-05-10 |
| Wafer Processing Method And Cutting Apparatus App 20180114697 - Sekiya; Kazuma | 2018-04-26 |
| Method Of Laser-processing Device Wafer App 20180108565 - Sekiya; Kazuma | 2018-04-19 |
| Processing Apparatus App 20180102268 - Sekiya; Kazuma | 2018-04-12 |
| Grinding Apparatus And Wafer Processing Method App 20180099373 - Sekiya; Kazuma | 2018-04-12 |
| Processing Apparatus And Processing Method For Workpiece App 20180099377 - Sekiya; Kazuma | 2018-04-12 |
| Processing Apparatus App 20180097564 - Sekiya; Kazuma | 2018-04-05 |
| Method Of Manufacturing Surface Acoustic Wave Device Chips App 20180076784 - Sekiya; Kazuma | 2018-03-15 |
| Management System For Supervising Operator App 20180012169 - Sekiya; Kazuma | 2018-01-11 |
| Method Of Sorting Chips App 20170328867 - Sekiya; Kazuma ; et al. | 2017-11-16 |
| Wafer Processing Method App 20170330799 - Sekiya; Kazuma | 2017-11-16 |
| Chip arranging method Grant 9,806,057 - Sekiya October 31, 2 | 2017-10-31 |
| Workpiece Processing Method App 20170243787 - Sekiya; Kazuma | 2017-08-24 |
| Electric Vehicle And Equipment Therefor App 20170217321 - Sekiya; Kazuma | 2017-08-03 |
| Exposure Apparatus App 20170212425 - Sekiya; Kazuma | 2017-07-27 |
| Chip Accommodation Tray App 20170186635 - Sekiya; Kazuma | 2017-06-29 |
| Human Transporting Drone App 20170166309 - Sekiya; Kazuma | 2017-06-15 |
| Workpiece cutting method using dummy wafer to determine condition of cutting blade Grant 9,627,260 - Sekiya April 18, 2 | 2017-04-18 |
| Wafer Processing Method App 20170103920 - Sekiya; Kazuma | 2017-04-13 |
| Inline system Grant 9,607,872 - Sekiya March 28, 2 | 2017-03-28 |
| Small Unmanned Air Vehicle Repulsing Apparatus App 20160376029 - Sekiya; Kazuma | 2016-12-29 |
| Workpiece Cutting Method App 20160284611 - Sekiya; Kazuma | 2016-09-29 |
| Method For Inspecting Cutting Blade App 20160279753 - Sekiya; Kazuma | 2016-09-29 |
| Wafer Processing System App 20160240415 - Sekiya; Kazuma | 2016-08-18 |
| Lighting apparatus and illumination management method of the same Grant 9,420,668 - Sekiya August 16, 2 | 2016-08-16 |
| Human Resources Management System App 20160196616 - Sekiya; Kazuma | 2016-07-07 |
| Lighting Apparatus And Illumination Management Method Of The Same App 20150359071 - Sekiya; Kazuma | 2015-12-10 |
| Wafer Processing Method App 20150303113 - Sekiya; Kazuma | 2015-10-22 |
| Modified layer forming method Grant 9,149,886 - Sekiya October 6, 2 | 2015-10-06 |
| Chip Arranging Method App 20150262971 - Sekiya; Kazuma | 2015-09-17 |
| Resin powder wafer processing utilizing a frame with a plurality of partitions Grant 9,123,797 - Sekiya , et al. September 1, 2 | 2015-09-01 |
| Wafer processing utilizing a frame with a plurality of partitions Grant 9,112,019 - Sekiya , et al. August 18, 2 | 2015-08-18 |
| Device wafer processing method Grant 9,082,712 - Sekiya July 14, 2 | 2015-07-14 |
| Optical device wafer processing method Grant 9,048,349 - Sekiya June 2, 2 | 2015-06-02 |
| Wafer Processing Method App 20150147870 - Sekiya; Kazuma ; et al. | 2015-05-28 |
| Wafer Processing Method App 20150140784 - Sekiya; Kazuma ; et al. | 2015-05-21 |
| Package substrate processing method Grant 9,023,687 - Sekiya May 5, 2 | 2015-05-05 |
| Device Wafer Processing Method App 20150087207 - Sekiya; Kazuma | 2015-03-26 |
| Device Wafer Processing Method App 20150072507 - Sekiya; Kazuma | 2015-03-12 |
| Information exchanging method using two-dimensional code Grant 8,967,470 - Sekiya , et al. March 3, 2 | 2015-03-03 |
| Wafer processing method Grant 8,962,451 - Sekiya February 24, 2 | 2015-02-24 |
| Wafer processing method Grant 8,956,957 - Sekiya February 17, 2 | 2015-02-17 |
| Wafer processing method Grant 8,956,956 - Sekiya February 17, 2 | 2015-02-17 |
| Optical device processing method Grant 8,945,960 - Sekiya February 3, 2 | 2015-02-03 |
| Optical device processing method Grant 8,945,963 - Sekiya February 3, 2 | 2015-02-03 |
| Method of attaching wafer to sheet Grant 8,895,326 - Sekiya , et al. November 25, 2 | 2014-11-25 |
| Optical device processing method Grant 8,802,463 - Sekiya August 12, 2 | 2014-08-12 |
| Optical device processing method Grant 8,802,470 - Sekiya August 12, 2 | 2014-08-12 |
| Method Of Attaching Wafer To Sheet App 20140134761 - Sekiya; Kazuma ; et al. | 2014-05-15 |
| Wafer Processing Method App 20140127884 - Sekiya; Kazuma | 2014-05-08 |
| Wafer Processing Method App 20140127883 - Sekiya; Kazuma | 2014-05-08 |
| Wafer Processing Method App 20140127882 - Sekiya; Kazuma | 2014-05-08 |
| Inline System App 20140050552 - SEKIYA; Kazuma | 2014-02-20 |
| Package Substrate Processing Method App 20140030850 - SEKIYA; Kazuma | 2014-01-30 |
| Wafer Processing Method App 20130344775 - SEKIYA; Kazuma | 2013-12-26 |
| Optical Device Processing Method App 20130330855 - SEKIYA; Kazuma | 2013-12-12 |
| Optical Device Processing Method App 20130330856 - SEKIYA; Kazuma | 2013-12-12 |
| Optical Device Processing Method App 20130330857 - SEKIYA; Kazuma | 2013-12-12 |
| Optical Device Processing Method App 20130330869 - SEKIYA; Kazuma | 2013-12-12 |
| Modified Layer Forming Method App 20130306605 - SEKIYA; Kazuma | 2013-11-21 |
| Information Exchanging Method Using Two-dimensional Code App 20130299576 - SEKIYA; Kazuma ; et al. | 2013-11-14 |
| Tool cutting method for workpiece having a plurality of LED chips sealed by sealing member Grant 8,574,930 - Sekiya November 5, 2 | 2013-11-05 |
| Laser processing method for wafer Grant 8,541,287 - Sekiya September 24, 2 | 2013-09-24 |
| Tool Cutting Method For Workpiece Having A Plurality Of Led Chips Sealed By Sealing Member App 20130164864 - SEKIYA; Kazuma | 2013-06-27 |
| Laser Processing Method For Wafer App 20130164914 - Sekiya; Kazuma | 2013-06-27 |
| Wafer Processing Method App 20130143413 - SEKIYA; Kazuma | 2013-06-06 |
| Processing Method For Semiconductor Wafer Having Passivation Film On The Front Side Thereof App 20130115756 - SEKIYA; Kazuma | 2013-05-09 |
| Optical device wafer processing method and laser processing apparatus Grant 8,431,428 - Sekiya April 30, 2 | 2013-04-30 |
| Method of managing parts Grant 8,417,579 - Sekiya April 9, 2 | 2013-04-09 |
| Signal System App 20120286971 - SEKIYA; Kazuma | 2012-11-15 |
| Power Managing System App 20120286573 - Sekiya; Kazuma | 2012-11-15 |
| Optical Device Wafer Processing Method App 20120156858 - Sekiya; Kazuma | 2012-06-21 |
| Processing method for package substrate Grant 8,198,175 - Sekiya , et al. June 12, 2 | 2012-06-12 |
| Method Of Managing Parts App 20120047047 - Sekiya; Kazuma | 2012-02-23 |
| Manufacturing method for composite substrate Grant 8,104,665 - Sekiya January 31, 2 | 2012-01-31 |
| Optical Device Wafer Processing Method And Laser Processing Apparatus App 20110256689 - Sekiya; Kazuma | 2011-10-20 |
| Optical Device Wafer Processing Method App 20110244612 - Sekiya; Kazuma | 2011-10-06 |
| Back grinding method for wafer Grant 8,025,553 - Sekiya , et al. September 27, 2 | 2011-09-27 |
| Wafer treating method Grant 8,021,963 - Sekiya September 20, 2 | 2011-09-20 |
| Wafer grinding method Grant 8,016,643 - Sekiya September 13, 2 | 2011-09-13 |
| Processing Method For Package Substrate App 20110212574 - Sekiya; Kazuma ; et al. | 2011-09-01 |
| Wafer processing method without occurrence of damage to device area Grant 7,994,025 - Sekiya August 9, 2 | 2011-08-09 |
| Manufacturing Method For Composite Substrate App 20110155791 - Sekiya; Kazuma | 2011-06-30 |
| Method for manufacturing device Grant 7,960,250 - Sekiya June 14, 2 | 2011-06-14 |
| Wafer Processing Method Without Occurrence Of Damage To Device Area App 20110097852 - Sekiya; Kazuma | 2011-04-28 |
| Wafer processing method Grant 7,915,142 - Sekiya March 29, 2 | 2011-03-29 |
| Wafer Processing Method App 20100311225 - Sekiya; Kazuma | 2010-12-09 |
| Manufacturing method for devices Grant 7,825,009 - Sekiya November 2, 2 | 2010-11-02 |
| Laser Beam Processing Machine App 20100270273 - Sekiya; Kazuma | 2010-10-28 |
| Micromachine device processing method Grant 7,816,184 - Sekiya October 19, 2 | 2010-10-19 |
| Mail magazine distribution system Grant 7,814,177 - Sekiya October 12, 2 | 2010-10-12 |
| Device grinding method Grant 7,713,106 - Sekiya May 11, 2 | 2010-05-11 |
| Semiconductor wafer and processing method for same Grant 7,705,430 - Sekiya April 27, 2 | 2010-04-27 |
| Wafer dividing method Grant 7,696,010 - Sekiya , et al. April 13, 2 | 2010-04-13 |
| Wafer dividing method and apparatus Grant 7,687,373 - Sekiya March 30, 2 | 2010-03-30 |
| Wafer inspecting method and device Grant 7,675,614 - Sekiya March 9, 2 | 2010-03-09 |
| Production method for device Grant 7,648,889 - Sekiya January 19, 2 | 2010-01-19 |
| Wafer Treating Method App 20100009549 - Sekiya; Kazuma | 2010-01-14 |
| Method For Forming Electrode On Semiconductor Wafer App 20090325380 - Sekiya; Kazuma | 2009-12-31 |
| Wafer processing method Grant 7,629,230 - Sekiya , et al. December 8, 2 | 2009-12-08 |
| Wafer processing method and adhesive tape used in the wafer processing method Grant 7,608,523 - Sekiya October 27, 2 | 2009-10-27 |
| Method of machining wafer Grant 7,608,483 - Sekiya October 27, 2 | 2009-10-27 |
| Mail Magazine Distribution System App 20090259733 - Sekiya; Kazuma | 2009-10-15 |
| Exposure method Grant 7,601,485 - Sekiya , et al. October 13, 2 | 2009-10-13 |
| Die Bonding Method And Die Bonder App 20090209066 - Sekiya; Kazuma | 2009-08-20 |
| Processing method and grinding apparatus of wafer Grant 7,559,826 - Sekiya July 14, 2 | 2009-07-14 |
| Semiconductor wafer processing method Grant 7,550,387 - Sekiya , et al. June 23, 2 | 2009-06-23 |
| Wafer laser processing method Grant 7,521,337 - Sekiya , et al. April 21, 2 | 2009-04-21 |
| Micromachine Device Processing Method App 20090098711 - Sekiya; Kazuma | 2009-04-16 |
| Wafer App 20090057841 - SEKIYA; Kazuma | 2009-03-05 |
| Semiconductor Wafer Processing Method App 20090061599 - Sekiya; Kazuma ; et al. | 2009-03-05 |
| Wafer processing method App 20090042368 - Sekiya; Kazuma ; et al. | 2009-02-12 |
| Back Grinding Method For Wafer App 20090042488 - Sekiya; Kazuma ; et al. | 2009-02-12 |
| Semiconductor wafer and processing method for same App 20090036034 - Sekiya; Kazuma | 2009-02-05 |
| Method Of Machining Wafer App 20080305578 - Sekiya; Kazuma | 2008-12-11 |
| Water jet-processing machine Grant 7,455,568 - Sekiya November 25, 2 | 2008-11-25 |
| Wafer Inspecting Method And Device App 20080285021 - Sekiya; Kazuma | 2008-11-20 |
| Device grinding method App 20080254715 - Sekiya; Kazuma | 2008-10-16 |
| Method For Manufacturing Device App 20080251188 - SEKIYA; Kazuma | 2008-10-16 |
| Liquid Resin Coating Method And Apparatus App 20080248207 - Sekiya; Kazuma | 2008-10-09 |
| Method Of Manufacturing Device App 20080233712 - Sekiya; Kazuma | 2008-09-25 |
| Manufacturing Method For Devices App 20080233711 - Sekiya; Kazuma | 2008-09-25 |
| Power Feeding System App 20080185913 - Sekiya; Kazuma | 2008-08-07 |
| Wafer Grinding Method App 20080176491 - SEKIYA; Kazuma | 2008-07-24 |
| Wafer dividing method and apparatus App 20080102606 - Sekiya; Kazuma | 2008-05-01 |
| Processing method for semiconductor wafer Grant 7,348,275 - Sekiya March 25, 2 | 2008-03-25 |
| Method of etching wafer App 20080045015 - Sekiya; Kazuma | 2008-02-21 |
| Wafer laser processing method App 20080007737 - Sekiya; Kazuma ; et al. | 2008-01-10 |
| Cutting machine for plate-shaped material Grant 7,316,174 - Sekiya January 8, 2 | 2008-01-08 |
| Sensing mechanism for crystal orientation indication mark of semiconductor wafer App 20070284764 - Sekiya; Kazuma | 2007-12-13 |
| Method of manufacturing chip resistor Grant 7,305,754 - Sekiya , et al. December 11, 2 | 2007-12-11 |
| Wafer processing method Grant 7,288,467 - Sekiya , et al. October 30, 2 | 2007-10-30 |
| Method and apparatus for supporting wafer App 20070238264 - Sekiya; Kazuma | 2007-10-11 |
| Semiconductor wafer App 20070166146 - Sekiya; Kazuma | 2007-07-19 |
| Wafer dividing method App 20070141811 - Sekiya; Kazuma ; et al. | 2007-06-21 |
| Wafer processing method App 20070105348 - Sekiya; Kazuma | 2007-05-10 |
| Production method for device App 20070093040 - Sekiya; Kazuma | 2007-04-26 |
| Wafer processing method and adhesive tape used in the wafer processing method App 20070045799 - Sekiya; Kazuma | 2007-03-01 |
| Cutting apparatus equipped with blade detection means App 20070028734 - Sekiya; Kazuma | 2007-02-08 |
| Processing method and grinding apparatus of wafer App 20070020887 - Sekiya; Kazuma | 2007-01-25 |
| Processing method for semiconductor wafer App 20070007247 - Sekiya; Kazuma | 2007-01-11 |
| Semiconductor wafer App 20060255431 - Sekiya; Kazuma | 2006-11-16 |
| Semiconductor wafer and processing method for same App 20060244096 - Sekiya; Kazuma | 2006-11-02 |
| Exposure method App 20060199114 - Sekiya; Kazuma ; et al. | 2006-09-07 |
| Finishing machine using laser beam Grant 7,057,136 - Sekiya June 6, 2 | 2006-06-06 |
| Wafer processing method App 20060094209 - Sekiya; Kazuma ; et al. | 2006-05-04 |
| Water jet-processing machine Grant 7,008,305 - Sekiya March 7, 2 | 2006-03-07 |
| Laser beam processing machine Grant 6,998,571 - Sekiya , et al. February 14, 2 | 2006-02-14 |
| Wiring fixing tool App 20060019514 - Sekiya; Kazuma | 2006-01-26 |
| Grindstone tool App 20060014475 - Sekiya; Kazuma | 2006-01-19 |
| Water jet processing method Grant 6,982,211 - Yajima , et al. January 3, 2 | 2006-01-03 |
| Grinding wheel Grant 6,966,826 - Suzuki , et al. November 22, 2 | 2005-11-22 |
| Method of processing a semiconductor wafer Grant 6,944,370 - Sekiya September 13, 2 | 2005-09-13 |
| Water jet processing method App 20050196940 - Yajima, Koichi ; et al. | 2005-09-08 |
| Water jet-processing machine App 20050191951 - Sekiya, Kazuma | 2005-09-01 |
| Water jet-processing machine App 20050181713 - Sekiya, Kazuma | 2005-08-18 |
| Cutting machine for plate-shaped material App 20050136801 - Sekiya, Kazuma | 2005-06-23 |
| Method of manufacturing chip resistor App 20050118774 - Sekiya, Kazuma ; et al. | 2005-06-02 |
| Method of exchanging test processing information App 20050044222 - Sekiya, Kazuma | 2005-02-24 |
| Laser beam processing machine App 20040211762 - Sekiya, Kazuma ; et al. | 2004-10-28 |
| Method for manufacturing semiconductor wafer App 20040203187 - Sekiya, Kazuma ; et al. | 2004-10-14 |
| Method for dividing semiconductor wafer Grant 6,803,247 - Sekiya October 12, 2 | 2004-10-12 |
| Finishing machine using laser beam App 20040195223 - Sekiya, Kazuma | 2004-10-07 |
| Method for dividing semiconductor wafer App 20040137700 - Sekiya, Kazuma | 2004-07-15 |
| Method for dividing semiconductor wafer App 20040115901 - Sekiya, Kazuma | 2004-06-17 |
| Method of processing a semiconductor wafer App 20040115903 - Sekiya, Kazuma | 2004-06-17 |
| Laser machining method App 20040112880 - Sekiya, Kazuma | 2004-06-17 |
| Laser machining method and laser machining apparatus App 20040089644 - Sekiya, Kazuma | 2004-05-13 |
| Cutting machine Grant 6,726,526 - Sekiya , et al. April 27, 2 | 2004-04-27 |
| Method of manufacturing semiconductor chip App 20040072388 - Sekiya, Kazuma | 2004-04-15 |
| Cutting machine having aligned dual spindles App 20040011176 - Sekiya, Kazuma | 2004-01-22 |
| Method of mounting a rotating tool to a spindle App 20040014408 - Sekiya, Kazuma | 2004-01-22 |
| Grinding wheel App 20030032382 - Suzuki, Masaaki ; et al. | 2003-02-13 |
| Cutting machine App 20020179079 - Sekiya, Kazuma ; et al. | 2002-12-05 |
| Semiconductor wafer dividing method Grant 6,465,158 - Sekiya October 15, 2 | 2002-10-15 |
| Semiconductor device App 20020050637 - Sekiya, Kazuma | 2002-05-02 |
| Cutting machine App 20020045414 - Sekiya, Kazuma ; et al. | 2002-04-18 |
| Experimental information exchanging system App 20020016751 - Sekiya, Kazuma | 2002-02-07 |
| Method of dicing workpiece Grant 6,344,402 - Sekiya February 5, 2 | 2002-02-05 |
| Non-contact thickness-measuring device App 20020005958 - Sekiya, Kazuma | 2002-01-17 |
| Cutting machine App 20010044256 - Sekiya, Kazuma | 2001-11-22 |
| Cutting-and-transferring system and pellet transferring apparatus App 20010040197 - Sekiya, Kazuma ; et al. | 2001-11-15 |
| Cutting apparatus equipped with a blade aligning means App 20010032533 - Sekiya, Kazuma | 2001-10-25 |
| Machining apparatus capable of saving different fluids in machining App 20010023691 - Sekiya, Kazuma | 2001-09-27 |
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