Sekiya; Junichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sekiya; Junichi.The latest application filed is for "selegiline-containing adhesive preparation".

Company Profile

0.8.14

Sekiya; Junichi - Ibaraki JP
SEKIYA; Junichi - Osaka JP
Sekiya; Junichi - Ibaraki-shi JP
Sekiya; Junichi - Oaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Percutaneous absorption-type pharmaceutical preparation Grant 8,409,609 - Inosaka , et al. April 2, 2	2013-04-02
Transdermal patch having a pressure-sensitive adhesive comprising (meth)acrylic acid alkyl ester, N-hydroxyalkyl(meth)acrylamide, and vinyl monomers Grant 8,361,493 - Ishikura , et al. January 29, 2	2013-01-29
Patch package structure Grant 8,096,417 - Iwao , et al. January 17, 2	2012-01-17
Patch package structure Grant 8,033,395 - Iwao , et al. October 11, 2	2011-10-11
Selegiline-containing Adhesive Preparation App 20110223235 - INOSAKA; Keigo ; et al.	2011-09-15
Patch And Patch Preparation App 20110123598 - ISHIKURA; Jun ; et al.	2011-05-26
Medical Pressure-sensitive Adhesive Composition App 20110124833 - ISHIKURA; Jun ; et al.	2011-05-26
Adhesive Preparation Containing Donepezil, And Package Of The Same App 20110056863 - Sekiya; Junichi ; et al.	2011-03-10
Adhesive and laminate Grant 7,754,235 - Akemi , et al. July 13, 2	2010-07-13
Method For Suppressing Coloring Of Adhesive Prepartion Containing Donepezil And Method For Reducing Amounts Of Donepezil-related Substances Formed App 20100062045 - Nishi; Sumiyo ; et al.	2010-03-11
Method For Suppressing Discoloration Over Time Of Adhesive Preparation Containing Donepezil App 20100048628 - Nishi; Sumiyo ; et al.	2010-02-25
Percutaneously Absorbable Preparation App 20100010043 - Hanatani; Akinori ; et al.	2010-01-14
Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon Grant 7,585,907 - Banba , et al. September 8, 2	2009-09-08
Patch package structure App 20090166236 - Iwao; Yoshihiro ; et al.	2009-07-02
Patch package structure App 20090166229 - Iwao; Yoshihiro ; et al.	2009-07-02
Stabilized donepezil-containing patch preparation App 20080131490 - Hanatani; Akinori ; et al.	2008-06-05
Percutaneous absorption-type pharmaceutical preparation App 20060292210 - Inosaka; Keigo ; et al.	2006-12-28
Percutaneous absorption-type pharmaceutical preparation App 20060275354 - Inosaka; Keigo ; et al.	2006-12-07
Adhesive and laminate App 20060246281 - Akemi; Hitoshi ; et al.	2006-11-02
Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer App 20060199883 - Banba; Tomohide ; et al.	2006-09-07

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