Sekiya; Haruhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sekiya; Haruhiko.The latest application filed is for "physical quantity measuring device and manufacturing method of physical quantity measuring device".

Company Profile

2.6.6

Sekiya; Haruhiko - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Physical quantity measurement including improved corrosion protection Grant 11,293,820 - Abe , et al. April 5, 2	2022-04-05
Physical Quantity Measuring Device And Manufacturing Method Of Physical Quantity Measuring Device App 20200309627 - Abe; Yusuke ; et al.	2020-10-01
Pressure sensor including sensor module having diaphragm and joint attached with the sensor module Grant 10,274,388 - Sekiya , et al.	2019-04-30
Physical quantity measuring device including a sensor module and a joint for locking the sensor module Grant 10,145,749 - Abe , et al. De	2018-12-04
Ceramic sensor module including diaphragm and cylindrical portion integrated with the diaphragm Grant 10,113,926 - Kobayashi , et al. October 30, 2	2018-10-30
Physical Quantity Measuring Sensor And Sensor Module App 20170299453 - Kobayashi; Hironori ; et al.	2017-10-19
Pressure Sensor App 20170292885 - Sekiya; Haruhiko ; et al.	2017-10-12
Physical quantity measuring sensor including an O-ring between a cylindrical portion and a cylindrical projection Grant 9,772,242 - Kobayashi , et al. September 26, 2	2017-09-26
Physical Quantity Measuring Device App 20170153157 - Abe; Yusuke ; et al.	2017-06-01
Physical Quantity Measuring Sensor And Sensor Module App 20150160085 - Kobayashi; Hironori ; et al.	2015-06-11
Fluid pressure sensor incorporating flexible circuit board Grant 8,286,496 - Sekiya , et al. October 16, 2	2012-10-16
Sensor App 20100206085 - Sekiya; Haruhiko ; et al.	2010-08-19

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