SEKINO; Akira
Patent Applications and Registrations
Patent applications and USPTO patent grants for SEKINO; Akira.The latest application filed is for "die bonding apparatus and die bonding method".
- SEKINO; Akira - Tokyo JP
| Patent | Date |
|---|---|
| Die Bonding Apparatus And Die Bonding Method App 20200243477 - NAKAMURA; Teruyuki ; et al. | 2020-07-30 |
| Die Bonding Apparatus And Die Bonding Method App 20170365578 - NAKAMURA; Teruyuki ; et al. | 2017-12-21 |
| Conveyor device for conveying food Grant 9,540,176 - Matsuzaki , et al. January 10, 2 | 2017-01-10 |
| Conveyor device for conveying food Grant 9,440,793 - Matsuzaki , et al. September 13, 2 | 2016-09-13 |
| Conveyor Device For Conveying Food App 20160194154 - MATSUZAKI; Tomohiko ; et al. | 2016-07-07 |
| Conveyor Device For Conveying Food App 20150353285 - MATSUZAKI; Tomohiko ; et al. | 2015-12-10 |
| Spiral transfer heat treatment apparatus Grant 8,567,308 - Onozato , et al. October 29, 2 | 2013-10-29 |
| Spiral Transfer Heat Treatment Apparatus App 20100147161 - ONOZATO; Masayuki ; et al. | 2010-06-17 |
| Flexible transfer installation and foodstuff transfer system provided with the flexible transfer installation Grant 7,401,696 - Miyanishi , et al. July 22, 2 | 2008-07-22 |
| Flexible transfer installation and foodstuff transfer system provided with the flexible transfer installation App 20050224316 - Miyanishi, Hideki ; et al. | 2005-10-13 |
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