loadpatents
name:-0.046350955963135
name:-0.033666849136353
name:-0.0090858936309814
SEKINE; Yurina Patent Filings

SEKINE; Yurina

Patent Applications and Registrations

Patent applications and USPTO patent grants for SEKINE; Yurina.The latest application filed is for "epidermal sensing systems for optical readout, visualization and analysis of biofluids".

Company Profile
6.37.37
  • SEKINE; Yurina - Evanston IL
  • SEKINE; Yurina - Ibaraki JP
  • Sekine; Yurina - Tokyo JP
  • Sekine; Yurina - Katsushika-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Epidermal Sensing Systems For Optical Readout, Visualization And Analysis Of Biofluids
App 20210145352 - ROGERS; John A. ;   et al.
2021-05-20
Microfluidic systems for epidermal sampling and sensing
Grant 10,925,523 - Rogers , et al. February 23, 2
2021-02-23
Microfluidic Systems For Epidermal Sampling And Sensing
App 20210000395 - ROGERS; John A. ;   et al.
2021-01-07
Process For Producing Carbonate Apatite
App 20200216318 - SEKINE; Yurina ;   et al.
2020-07-09
Carbonate Apatite With High Carbonate Content
App 20200215513 - SEKINE; Yurina ;   et al.
2020-07-09
Microfluidic Systems For Epidermal Sampling And Sensing
App 20200155047 - ROGERS; John A. ;   et al.
2020-05-21
Method for forming functional part in minute space
Grant 9,950,925 - Sekine , et al. April 24, 2
2018-04-24
Method For Forming Functional Part In Minute Space
App 20170305743 - Sekine; Shigenobu ;   et al.
2017-10-26
Substrate with built-in passive element
Grant 9,730,325 - Sekine , et al. August 8, 2
2017-08-08
Substrate for electronic device and electronic device
Grant 9,704,793 - Sekine , et al. July 11, 2
2017-07-11
Insulating paste, electronic device and method for forming insulator
Grant 9,691,519 - Sekine , et al. June 27, 2
2017-06-27
Electronic device and manufacturing method therefor
Grant 9,685,394 - Sekine , et al. June 20, 2
2017-06-20
Semiconductor substrate, eletronic device and method for manufacturing the same
Grant 9,460,965 - Sekine , et al. October 4, 2
2016-10-04
Integrated circuit device
Grant 9,349,720 - Sekine , et al. May 24, 2
2016-05-24
Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flow
Grant 9,339,871 - Sekine , et al. May 17, 2
2016-05-17
Functional material
Grant 9,293,416 - Sekine , et al. March 22, 2
2016-03-22
Semiconductor substrate, electronic device and method for manufacturing the same
Grant 9,230,860 - Sekine , et al. January 5, 2
2016-01-05
Semiconductor Substrate, Eletronic Device And Method For Manufacturing The Same
App 20150357273 - Sekine; Shigenobu ;   et al.
2015-12-10
Wiring substrate and manufacturing method therefor
Grant 9,076,786 - Sekine , et al. July 7, 2
2015-07-07
Functional Material
App 20150054158 - Sekine; Shigenobu ;   et al.
2015-02-26
Wiring Substrate And Manufacturing Method Therefor
App 20150041990 - Sekine; Shigenobu ;   et al.
2015-02-12
Integrated Circuit Device
App 20150035114 - Sekine; Shigenobu ;   et al.
2015-02-05
Spherical Particles Having Nanometer Size, Crystalline Structure, And Good Sphericity And Method For Producing The Same
App 20140290435 - Sekine; Shigenobu ;   et al.
2014-10-02
Substrate With Built-in Passive Element
App 20140204548 - Sekine; Shigenobu ;   et al.
2014-07-24
Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the same
Grant 8,766,312 - Sekine , et al. July 1, 2
2014-07-01
Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same
Grant 8,758,900 - Sekine , et al. June 24, 2
2014-06-24
Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
Grant 8,759,211 - Sekine , et al. June 24, 2
2014-06-24
Insulating Paste, Electronic Device And Method For Forming Insulator
App 20140147578 - Sekine; Shigenobu ;   et al.
2014-05-29
Method For Producing Wiring Board Having Through Hole Or Non-through Hole
App 20140023777 - Sekine; Shigenobu ;   et al.
2014-01-23
Circuit board, electronic device and method for manufacturing the same
Grant 8,609,999 - Sekine , et al. December 17, 2
2013-12-17
Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
Grant 8,580,581 - Sekine , et al. November 12, 2
2013-11-12
Wiring board having through hole or non-through hole, and method for producing the same
Grant 8,569,632 - Sekine , et al. October 29, 2
2013-10-29
Electronic Device
App 20130277850 - Sekine; Shigenobu ;   et al.
2013-10-24
Conductive Fine Powder, Conductive Paste And Electronic Component
App 20130250481 - Sekine; Shigenobu ;   et al.
2013-09-26
Electronic Device, Conductive Composition, Metal Filling Apparatus, And Electronic Device Manufacturing Method
App 20130186943 - SEKINE; Shigenobu ;   et al.
2013-07-25
Method For Forming Functional Part In Minute Space
App 20130136645 - Sekine; Shigenobu ;   et al.
2013-05-30
Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
Grant 8,415,784 - Sekine , et al. April 9, 2
2013-04-09
Semiconductor Substrate, Eletronic Device And Method For Manufacturing The Same
App 20130075930 - Sekine; Shigenobu ;   et al.
2013-03-28
Filling material and filling method using the same
Grant 8,377,565 - Sekine , et al. February 19, 2
2013-02-19
Circuit board, electronic device and method for manufacturing the same
Grant 8,217,280 - Sekine , et al. July 10, 2
2012-07-10
Electronic device
Grant 8,217,403 - Sekine , et al. July 10, 2
2012-07-10
Substrate For Electronic Device And Electronic Device
App 20120168206 - Sekine; Shigenobu ;   et al.
2012-07-05
Light-emitting Device And Method For Manufacturing The Same
App 20120091481 - Sekine; Shigenobu ;   et al.
2012-04-19
Method for filling metal into fine space
Grant 8,079,131 - Sekine , et al. December 20, 2
2011-12-20
Electronic Device And Manufacturing Method Therefor
App 20110284912 - Sekine; Shigenobu ;   et al.
2011-11-24
Filling Material And Filling Method Using The Same
App 20110262762 - Sekine; Shigenobu ;   et al.
2011-10-27
Solar Cell
App 20110232740 - SEKINE; Shigenobu ;   et al.
2011-09-29
Circuit Board, Electronic Device And Method For Manuacturing The Same
App 20110141704 - SEKINE; Shigenobu ;   et al.
2011-06-16
Substrate For Electronic Device, Stack For Electronic Device, Electronic Device, And Method For Manufacturing The Same
App 20110140281 - SEKINE; Shigenobu ;   et al.
2011-06-16
Circuit Board, Electronic Device And Method For Manufacturing The Same
App 20110120759 - SEKINE; Shigenobu ;   et al.
2011-05-26
Circuit board, electronic device and method for manufacturing the same
Grant 7,910,837 - Sekine , et al. March 22, 2
2011-03-22
Electronic Device, Conductive Composition, Metal Filling Apparatus, And Electronic Device Manufacturing Method
App 20100301485 - SEKINE; Shigenobu ;   et al.
2010-12-02
Light-emitting diode, light-emitting device, lighting apparatus, display, and signal light
Grant 7,842,958 - Sekine , et al. November 30, 2
2010-11-30
Method for producing spherical particles having nanometer size, crystalline structure, and good sphericity
Grant 7,803,210 - Sekine , et al. September 28, 2
2010-09-28
Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same
App 20100239863 - Sekine; Shigenobu ;   et al.
2010-09-23
Lubricant composition and bearing structure
Grant 7,781,382 - Sekine , et al. August 24, 2
2010-08-24
Method For Filling Metal Into Fine Space
App 20100126688 - SEKINE; Shigenobu ;   et al.
2010-05-27
Method For Filling Through Hole Or Non-through Hole Formed On Board With Filler
App 20100031501 - Sekine; Shigenobu ;   et al.
2010-02-11
Circuit Board, Electronic Device And Method For Manufacturing The Same
App 20090084588 - SEKINE; Shigenobu ;   et al.
2009-04-02
Lubricant composition and bearing structure
App 20080132433 - Sekine; Shigenobu ;   et al.
2008-06-05
Wiring board having through hole or non-through hole, and method for producing the same
App 20080095926 - Sekine; Shigenobu ;   et al.
2008-04-24
Spherical Particles Having Nanometer Size, Crystalline Structure, And Good Sphericity And Method For Producing
App 20080038555 - SEKINE; Shigenobu ;   et al.
2008-02-14

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