Sekihara; Kanji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sekihara; Kanji.The latest application filed is for "injection mold and method for molding an optical element".
- Sekihara; Kanji - Toyokawa JP
- Sekihara; Kanji - Toyokawa-shi JP
- Sekihara; Kanji - Aichi JP
- Sekihara; Kanji - Aichi-ken JP
| Patent | Date |
|---|---|
| Microchip, molding die for microchip, and manufacturing apparatus for manufacturing microchip Grant 9,238,322 - Sekihara January 19, 2 | 2016-01-19 |
| Optical-parts molding die and optical-parts manufacturing method Grant 8,852,471 - Naito , et al. October 7, 2 | 2014-10-07 |
| Injection Mold And Method For Molding An Optical Element App 20130249128 - Okumura; Yoshihiro ; et al. | 2013-09-26 |
| Molding Die, Microchip Manufactured By Using Molding Die, And Manufacturing Apparatus For Manufacturing Microchip App 20130221544 - Sekihara; Kanji | 2013-08-29 |
| Microchip and process for producing microchip Grant 8,404,193 - Sekihara , et al. March 26, 2 | 2013-03-26 |
| Method for manufacturing micro-channel, die for molding micro-channel chip, and micro-channel chip Grant 8,377,362 - Sekihara , et al. February 19, 2 | 2013-02-19 |
| Injection molding machine Grant 8,287,264 - Matsumoto , et al. October 16, 2 | 2012-10-16 |
| Bonding method of resin member Grant 8,268,112 - Sekihara , et al. September 18, 2 | 2012-09-18 |
| Optical component molding apparatus and method thereof Grant 8,142,690 - Matsumoto , et al. March 27, 2 | 2012-03-27 |
| Injection molding method and injection molding die Grant 8,123,998 - Sekihara February 28, 2 | 2012-02-28 |
| Optical element molding apparatus Grant 7,988,441 - Sekihara , et al. August 2, 2 | 2011-08-02 |
| Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip App 20110133364 - Sekihara; Kanji | 2011-06-09 |
| Microchip and Process for Producing Microchip App 20110135539 - Sekihara; Kanji ; et al. | 2011-06-09 |
| Microchip App 20110135538 - Goshima; Takehiko ; et al. | 2011-06-09 |
| Optical component molding apparatus Grant 7,914,273 - Naito , et al. March 29, 2 | 2011-03-29 |
| Microchip manufacturing method Grant 7,901,527 - Sekihara , et al. March 8, 2 | 2011-03-08 |
| Injection Molding Method and Injection Molding Die App 20110018171 - Sekihara; Kanji | 2011-01-27 |
| Mold assembly for optical parts and method of setup thereof Grant 7,790,070 - Sekihara , et al. September 7, 2 | 2010-09-07 |
| Optical-parts Molding Die And Optical-parts Manufacturing Method App 20100176522 - Naito; Atsushi ; et al. | 2010-07-15 |
| Device for and Method of Manufacturing Optical Part App 20100176523 - Sekihara; Kanji ; et al. | 2010-07-15 |
| Cold runner injection mold having an insulated gate Grant 7,708,550 - Sekihara , et al. May 4, 2 | 2010-05-04 |
| Bonding Method of Resin Member App 20100101720 - Sekihara; Kanji ; et al. | 2010-04-29 |
| Master and Microreactor App 20100074815 - Sekihara; Kanji ; et al. | 2010-03-25 |
| Microchip App 20100060998 - Sekihara; Kanji ; et al. | 2010-03-11 |
| Microchip Manufacturing Method App 20100012255 - Sekihara; Kanji ; et al. | 2010-01-21 |
| Optical Element Molding Apparatus App 20090324764 - Sekihara; Kanji ; et al. | 2009-12-31 |
| Metal Mold Assembly for Optical Part and Method of Setup Therefor App 20090315198 - Sekihara; Kanji ; et al. | 2009-12-24 |
| Optical component molding apparatus Grant 7,427,198 - Naito , et al. September 23, 2 | 2008-09-23 |
| Resin molding apparatus App 20070077322 - Sekihara; Kanji ; et al. | 2007-04-05 |
| Injection molding machine App 20070077327 - Matsumoto; Akihiko ; et al. | 2007-04-05 |
| Optical component molding apparatus App 20060093700 - Naito; Atsushi ; et al. | 2006-05-04 |
| Optical component molding apparatus App 20060093704 - Naito; Atsushi ; et al. | 2006-05-04 |
| Optical component molding apparatus and method thereof App 20060024403 - Matsumoto; Akihiko ; et al. | 2006-02-02 |
| Injection mold and method for molding an optical element App 20050285287 - Okumura, Yoshihiro ; et al. | 2005-12-29 |
| Injection mold and injection molding apparatus App 20050287243 - Sekihara, Kanji ; et al. | 2005-12-29 |
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