Sekiguchi; Susumu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sekiguchi; Susumu.The latest application filed is for "fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus".

Company Profile

0.16.14

Sekiguchi; Susumu - Takasaki JP
Sekiguchi; Susumu - Annaka JP
Sekiguchi; Susumu - Tochigi PA
Sekiguchi; Susumu - Annaka-shi JP
Sekiguchi; Susumu - Tokyo JP
Sekiguchi; Susumu - Usui-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,449,856 - Nakamura , et al. September 20, 2	2016-09-20
Semiconductor apparatus and method for producing the same Grant 9,401,290 - Shiobara , et al. July 26, 2	2016-07-26
Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus Grant 9,287,174 - Sekiguchi , et al. March 15, 2	2016-03-15
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus App 20160043012 - SEKIGUCHI; Susumu ; et al.	2016-02-11
Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,240,332 - Sekiguchi , et al. January 19, 2	2016-01-19
Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 9,129,912 - Akiba , et al. September 8, 2	2015-09-08
Method of manufacturing semiconductor apparatus and semiconductor apparatus Grant 9,129,976 - Akiba , et al. September 8, 2	2015-09-08
Antenna, semiconductor device, and method of manufacturing antenna Grant 9,111,195 - Aoki , et al. August 18, 2	2015-08-18
Encapsulant With Base For Use In Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20150028497 - NAKAMURA; Tomoaki ; et al.	2015-01-29
Fiber-containing Resin Substrate, Sealed Substrate Having Semiconductor Device Mounted Thereon, Sealed Wafer Having Semiconductor Device Formed Thereon, A Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20140329363 - SEKIGUCHI; Susumu ; et al.	2014-11-06
Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 8,872,358 - Shiobara , et al. October 28, 2	2014-10-28
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20140264956 - SHIOBARA; Toshio ; et al.	2014-09-18
Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus Grant 8,823,186 - Sekiguchi , et al. September 2, 2	2014-09-02
Encapsulant Equipped With Supporting Substrate, Encapsulated Substrate Having Semiconductor Devices Mounting Thereon, Encapsulated Wafer Having Semiconductor Devices Forming Thereon, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20140138857 - AKIBA; Hideki ; et al.	2014-05-22
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus App 20140138856 - SEKIGUCHI; Susumu ; et al.	2014-05-22
Method Of Manufacturing Semiconductor Apparatus And Semiconductor Apparatus App 20140091483 - AKIBA; Hideki ; et al.	2014-04-03
Antenna, Semiconductor Device, And Method Of Manufacturing Antenna App 20130313329 - AOKI; Tomoyuki ; et al.	2013-11-28
Semiconductor Apparatus And Method For Producing The Same App 20130241087 - SHIOBARA; Toshio ; et al.	2013-09-19
Antenna, semiconductor device, and method of manufacturing antenna Grant 8,528,827 - Aoki , et al. September 10, 2	2013-09-10
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20130200534 - SHIOBARA; Toshio ; et al.	2013-08-08
Fiber-containing Resin Substrate, Sealed Substrate Having Semiconductor Device Mounted Thereon, Sealed Wafer Having Semiconductor Device Formed Thereon, A Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus App 20120161339 - SEKIGUCHI; Susumu ; et al.	2012-06-28
Antenna, Semiconductor Device, And Method Of Manufacturing Antenna App 20110309904 - AOKI; Tomoyuki ; et al.	2011-12-22
Cement mold-making silicone rubber composition Grant 8,044,121 - Mogi , et al. October 25, 2	2011-10-25
Cement Mold-making Silicone Rubber Composition App 20090326103 - Mogi; Hiroshi ; et al.	2009-12-31
Fluorosilicone rubber composition and molded rubber article Grant 7,510,772 - Uno , et al. March 31, 2	2009-03-31
Fluorosilicone rubber composition and molded rubber article App 20060281875 - Uno; Takao ; et al.	2006-12-14
Silicone rubber compositions for high-voltage electrical insulators and polymer insulators Grant 6,063,487 - Azechi , et al. May 16, 2	2000-05-16
Method of producing silicone rubber compositions Grant 5,502,146 - Inoue , et al. March 26, 1	1996-03-26

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