Seki; Yuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seki; Yuki.The latest application filed is for "magnetic bearing controller and magnetic bearing control method".

Company Profile

2.15.15

Seki; Yuki - Yamato JP
Seki; Yuki - Kobe JP
SEKI; Yuki - Kobe-shi JP
SEKI; Yuki - Itami-shi JP
Seki; Yuki - Itami JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Connector assembly and connector pair Grant 11,424,565 - Someya , et al. August 23, 2	2022-08-23
Connector assembly Grant 11,411,333 - Someya , et al. August 9, 2	2022-08-09
Magnetic bearing controller and magnetic bearing control method Grant 11,323,008 - Takemura , et al. May 3, 2	2022-05-03
Magnetic Bearing Controller And Magnetic Bearing Control Method App 20210273521 - TAKEMURA; Soichiro ; et al.	2021-09-02
Connector Assembly App 20210143567 - SOMEYA; Toshiyuki ; et al.	2021-05-13
Connector Assembly And Connector Pair App 20210135385 - SOMEYA; Toshiyuki ; et al.	2021-05-06
Group Iii Nitride Composite Substrate And Method For Manufacturing The Same, And Method For Manufacturing Group Iii Nitride Semi App 20200176305 - ISHIBASHI; Keiji ; et al.	2020-06-04
Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device Grant 10,600,676 - Ishibashi , et al.	2020-03-24
Group Iii Nitride Composite Substrate And Method For Manufacturing The Same, And Method For Manufacturing Group Iii Nitride Semiconductor Device App 20180166325 - ISHIBASHI; Keiji ; et al.	2018-06-14
Group III nitride composite substrate and method for manufacturing the same, laminated group III nitride composite substrate, and group III nitride semiconductor device and method for manufacturing the same Grant 9,923,063 - Ishibashi , et al. March 20, 2	2018-03-20
Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device Grant 9,917,004 - Ishibashi , et al. March 13, 2	2018-03-13
Group Iii Nitride Composite Substrate And Method For Manufacturing The Same, Laminated Group Iii Nitride Composite Substrate, And Group Iii Nitride Semiconductor Device And Method For Manufacturing The Same App 20150380496 - ISHIBASHI; Keiji ; et al.	2015-12-31
Composite base including sintered base and base surface flattening layer, and composite substrate including that composite base and semiconductor crystalline layer Grant 9,184,228 - Seki , et al. November 10, 2	2015-11-10
Group Iii Nitride Composite Substrate And Method For Manufacturing The Same, And Method For Manufacturing Group Iii Nitride Semiconductor Device App 20150194442 - Ishibashi; Keiji ; et al.	2015-07-09
Method of Manufacturing GaN-Based Film and Composite Substrate Used Therefor App 20150118830 - SATOH; Issei ; et al.	2015-04-30
Method of manufacturing GaN-based film and composite substrate used therefor Grant 8,962,365 - Satoh , et al. February 24, 2	2015-02-24
Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that method Grant 8,748,890 - Seki , et al. June 10, 2	2014-06-10
Method of manufacturing GaN-based film Grant 8,697,550 - Satoh , et al. April 15, 2	2014-04-15
Method Of Manufacturing Semiconductor Wafer, And Composite Base And Composite Substrate For Use In That Method App 20130221492 - SEKI; Yuki ; et al.	2013-08-29
Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that method Grant 8,497,185 - Seki , et al. July 30, 2	2013-07-30
METHOD OF MANUFACTURING GaN-BASED FILM AND COMPOSITE SUBSTRATE USED THEREFOR App 20130149847 - Satoh; Issei ; et al.	2013-06-13
METHOD OF MANUFACTURING GaN-BASED FILM App 20130040442 - Satoh; Issei ; et al.	2013-02-14
Method Of Manufacturing Semiconductor Wafer, And Composite Base And Composite Substrate For Use In That Method App 20120228613 - SEKI; Yuki ; et al.	2012-09-13
Composite Base Including Sintered Base And Base Surface Flattening Layer, And Composite Substrate Including That Composite Base And Semiconductor Crystalline Layer App 20120228612 - Seki; Yuki ; et al.	2012-09-13

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