Seki; Yoshinobu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seki; Yoshinobu.The latest application filed is for "covering sheet and method of bending linear member with the same".
- Seki; Yoshinobu - Kosai JP
- Seki; Yoshinobu - Kosai-shi JP
- Seki; Yoshinobu - Aichi-ken JP
- Seki; Yoshinobu - Shizuoka JP
- Seki; Yoshinobu - Shizuoka-ken JP
| Patent | Date |
|---|---|
| Covering sheet and method of bending linear member with the same Grant 7,304,234 - Seki December 4, 2 | 2007-12-04 |
| Covering sheet and method of bending linear member with the same App 20070089893 - Seki; Yoshinobu | 2007-04-26 |
| Joint connector assembly Grant 6,655,981 - Seki December 2, 2 | 2003-12-02 |
| Wire harness circuit configuration method and wire harness Grant 6,494,722 - Sakamoto , et al. December 17, 2 | 2002-12-17 |
| Joint connector assembly App 20020001996 - Seki, Yoshinobu | 2002-01-03 |
| Joint connector Grant 5,908,322 - Seki June 1, 1 | 1999-06-01 |
| Joint connector Grant 5,645,455 - Seki July 8, 1 | 1997-07-08 |
| Disconnection mechanism for a dark current fuse Grant 5,629,663 - Seki , et al. May 13, 1 | 1997-05-13 |
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