Seki; Toshitake

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seki; Toshitake.The latest application filed is for "capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment".

Company Profile

1.10.8

Seki; Toshitake - Aichi JP
Seki; Toshitake - Komaki N/A JP
Seki; Toshitake - Komaki-shi JP
Seki; Toshitake - Niwa-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Glass panel for wiring board and method of manufacturing wiring board Grant 10,470,300 - Seki , et al. No	2019-11-05
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment Grant 8,546,700 - Yamamoto , et al. October 1, 2	2013-10-01
Wiring board and capacitor to be built into wiring board Grant 7,973,245 - Muramatsu , et al. July 5, 2	2011-07-05
Capacitor For Incorporation In Wiring Board, Wiring Board, Method Of Manufacturing Wiring Board, And Ceramic Chip For Embedment App 20110157763 - YAMAMOTO; Hiroshi ; et al.	2011-06-30
Wiring board and ceramic chip to be embedded Grant 7,956,454 - Yamamoto , et al. June 7, 2	2011-06-07
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment Grant 7,932,471 - Yamamoto , et al. April 26, 2	2011-04-26
Wiring Board And Ceramic Chip To Be Embedded App 20090255719 - Yamamoto; Hiroshi ; et al.	2009-10-15
Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same Grant 7,580,240 - Yamamoto , et al. August 25, 2	2009-08-25
Wiring board and ceramic chip to be embedded Grant 7,557,440 - Yamamoto , et al. July 7, 2	2009-07-07
Built-in capacitor type wiring board and method for manufacturing the same Grant 7,532,453 - Yamamoto , et al. May 12, 2	2009-05-12
Wiring Board And Capacitor To Be Built Into Wiring Board App 20080223607 - MURAMATSU; Masaki ; et al.	2008-09-18
Wiring board and capacitor to be built into wiring board Grant 7,345,246 - Muramatsu , et al. March 18, 2	2008-03-18
Built-in capacitor type wiring board and method for manufacturing the same App 20070121273 - Yamamoto; Hiroshi ; et al.	2007-05-31
Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same App 20070117338 - Yamamoto; Hiroshi ; et al.	2007-05-24
Wiring board and ceramic chip to be embedded App 20070045814 - Yamamoto; Hiroshi ; et al.	2007-03-01
Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment App 20070030628 - Yamamoto; Hiroshi ; et al.	2007-02-08
Wiring board and capacitor to be built into wiring board App 20060175083 - Muramatsu; Masaki ; et al.	2006-08-10

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