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Patent applications and USPTO patent grants for Seki; Hideo.The latest application filed is for "welding condition monitoring device".
Patent | Date |
---|---|
Image processing device and method capable of emphasizing the contrast of an image taken by an image sensor Grant 7,495,695 - Nakajima , et al. February 24, 2 | 2009-02-24 |
Welding condition monitoring device Grant 7,380,697 - Seki , et al. June 3, 2 | 2008-06-03 |
Welding Condition Monitoring Device App 20080061113 - Seki; Hideo ;   et al. | 2008-03-13 |
Image processing device Grant 7,221,808 - Shinotsuka , et al. May 22, 2 | 2007-05-22 |
Image processing device and method App 20050012847 - Nakajima, Atsushi ;   et al. | 2005-01-20 |
Welding condition monitoring device App 20040124227 - Seki, Hideo ;   et al. | 2004-07-01 |
Image processing device App 20040090545 - Shinotsuka, Sukeyuki ;   et al. | 2004-05-13 |
Device and method for protecting against the possible adverse health effects of electromagnetic radiation emissions App 20040046703 - Hatanaka, Takuji ;   et al. | 2004-03-11 |
Method of measuring electrical characteristics of semiconductor circuit in wafer state and semiconductor device for the same Grant 6,063,641 - Seki May 16, 2 | 2000-05-16 |
Operator with printer for analyzing machine of liquid chromatograph Grant D356,745 - Ninomiya , et al. March 28, 1 | 1995-03-28 |
Liquid chromatograph analyzer Grant D354,013 - Ninomiya , et al. January 3, 1 | 1995-01-03 |
Pump for analyzing machine of liquid chromatograph Grant D353,384 - Ninomiya , et al. December 13, 1 | 1994-12-13 |
Liquid sample injecting apparatus Grant 4,620,452 - Seki November 4, 1 | 1986-11-04 |
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