loadpatents
Patent applications and USPTO patent grants for Seitzer; Philip William.The latest application filed is for "method of electrical testing".
Patent | Date |
---|---|
Reinforced bond pad for a semiconductor device Grant 7,301,231 - Antol , et al. November 27, 2 | 2007-11-27 |
Method of electrical testing of an integrated circuit with an electrical probe Grant 7,239,160 - Golden , et al. July 3, 2 | 2007-07-03 |
Method of electrical testing App 20070024303 - Golden; James ;   et al. | 2007-02-01 |
Method of electrical testing Grant 7,132,840 - Golden , et al. November 7, 2 | 2006-11-07 |
Reinforced bond pad for a semiconductor device App 20060226535 - Antol; Joze E. ;   et al. | 2006-10-12 |
Reinforced bond pad for a semiconductor device Grant 7,115,985 - Antol , et al. October 3, 2 | 2006-10-03 |
Reinforced bond pad for a semiconductor device App 20060065969 - Antol; Joze E. ;   et al. | 2006-03-30 |
Method of electrical testing App 20060022689 - Golden; James ;   et al. | 2006-02-02 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.