Seita, Masaru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seita, Masaru.The latest application filed is for "composite material with improved binding strength and method for forming the same".

Company Profile

0.4.12

Seita, Masaru - Kitaadachi-gun JP
Seita; Masaru - Saitama JP
Seita, Masaru - Kawasaki JP
Seita; Masaru - Ina JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composite material with improved binding strength and method for forming the same App 20050164020 - Seita, Masaru ; et al.	2005-07-28
Method for forming resin composite material Grant 6,899,781 - Seita , et al. May 31, 2	2005-05-31
Electrolytic copper plating solution and method for controlling the same Grant 6,881,319 - Seita , et al. April 19, 2	2005-04-19
Formaldehyde-free electroless copper plating process and solution for use in the process App 20040253450 - Seita, Masaru ; et al.	2004-12-16
Resin composite material and method of forming the same App 20040170846 - Seita, Masaru ; et al.	2004-09-02
Direct patterning method App 20040101665 - Seita, Masaru ; et al.	2004-05-27
Method for manufacturing copper-resin composite material Grant 6,740,425 - Seita , et al. May 25, 2	2004-05-25
Composite material with improved binding strength and method for forming the same App 20040072015 - Seita, Masaru ; et al.	2004-04-15
Copper electroplating method using insoluble anode App 20040050706 - Seita, Masaru ; et al.	2004-03-18
Method for forming resin composite material App 20040001957 - Seita, Masaru ; et al.	2004-01-01
Process for electroplating silicon wafers App 20030155247 - Miura, Takeshi ; et al.	2003-08-21
Electrolytic copper plating solution and method for controlling the same App 20030094376 - Seita, Masaru ; et al.	2003-05-22
Method for manufacturing copper-resin composite material App 20030066754 - Seita, Masaru ; et al.	2003-04-10
Co-evaluation system App 20020099820 - Kishi, Kenichi ; et al.	2002-07-25
Co-evaluation system for component of electronic device App 20020087681 - Kishi, Kenichi ; et al.	2002-07-04
Electrolytic copper plating using a reducing agent Grant 5,454,930 - Miura , et al. October 3, 1	1995-10-03

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