Seike; Hideyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seike; Hideyuki.The latest application filed is for "method for producing semiconductor chip".

Company Profile

2.9.10

Seike; Hideyuki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing semiconductor chip Grant 10,354,973 - Orikasa , et al. July 16, 2	2019-07-16
Method For Producing Semiconductor Chip App 20190013293 - ORIKASA; Makoto ; et al.	2019-01-10
Method for producing semiconductor package Grant 10,163,847 - Orikasa , et al. Dec	2018-12-25
Method For Producing Semiconductor Package App 20180254255 - ORIKASA; Makoto ; et al.	2018-09-06
Method for producing semiconductor package Grant 9,818,736 - Orikasa , et al. November 14, 2	2017-11-14
Terminal structure, and semiconductor element and module substrate comprising the same Grant 9,257,402 - Yoshida , et al. February 9, 2	2016-02-09
Coating and electronic component Grant 9,177,687 - Yoshida , et al. November 3, 2	2015-11-03
Terminal structure and semiconductor device Grant 9,070,606 - Yoshida , et al. June 30, 2	2015-06-30
Terminal structure, and semiconductor element and module substrate comprising the same Grant 8,970,037 - Yoshida , et al. March 3, 2	2015-03-03
Coating and electronic component Grant 8,933,336 - Yoshida , et al. January 13, 2	2015-01-13
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure Grant 8,787,028 - Horikawa , et al. July 22, 2	2014-07-22
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same App 20140054769 - YOSHIDA; Kenichi ; et al.	2014-02-27
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same App 20140054770 - YOSHIDA; Kenichi ; et al.	2014-02-27
Terminal Structure And Semiconductor Device App 20140054767 - YOSHIDA; Kenichi ; et al.	2014-02-27
Terminal Structure And Semiconductor Device App 20140054768 - YOSHIDA; Kenichi ; et al.	2014-02-27
Structure Body And Electronic Component And Printed Wiring Board Including The Same App 20130192873 - ORIKASA; Makoto ; et al.	2013-08-01
Terminal Structure, Printed Circuit Board, Module Board, Electronic Device, And Method For Manufacturing Terminal Structure App 20130135834 - Horikawa; Yuhei ; et al.	2013-05-30
Coating And Electronic Component App 20130126208 - YOSHIDA; Kenichi ; et al.	2013-05-23
Coating And Electronic Component App 20130130059 - YOSHIDA; Kenichi ; et al.	2013-05-23

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