Seijo; Ma. Fatima

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seijo; Ma. Fatima.The latest application filed is for "aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate".

Company Profile

0.10.11

Seijo; Ma. Fatima - Hayward CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor For Cleaning Inorganic Residues On Semiconductor Substrate App 20150344826 - Wojtczak; William A. ; et al.	2015-12-03
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Grant 9,109,188 - Wojtczak , et al. August 18, 2	2015-08-18
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates Grant 7,662,762 - Wojtczak , et al. February 16, 2	2010-02-16
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor For Cleaning Inorganic Residues On Semiconductor Substrate App 20100035785 - Wojtczak; William A. ; et al.	2010-02-11
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Grant 7,605,113 - Wojtczak , et al. October 20, 2	2009-10-20
Post plasma ashing wafer cleaning formulation Grant 7,534,752 - Wojtczak , et al. May 19, 2	2009-05-19
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Grant 6,967,169 - Wojtczak , et al. November 22, 2	2005-11-22
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate App 20050215446 - Wojtczak, William A. ; et al.	2005-09-29
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates App 20050124517 - Wojtczak, William A. ; et al.	2005-06-09
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Grant 6,896,826 - Wojtczak , et al. May 24, 2	2005-05-24
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate App 20050003674 - Wojtczak, William A. ; et al.	2005-01-06
pH buffered compositions useful for cleaning residue from semiconductor substrates Grant 6,773,873 - Seijo , et al. August 10, 2	2004-08-10
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate Grant 6,755,989 - Wojtczak , et al. June 29, 2	2004-06-29
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures Grant 6,660,700 - Wojtczak , et al. December 9, 2	2003-12-09
pH buffered compositions useful for cleaning residue from semiconductor substrates App 20030181342 - Seijo, Ma. Fatima ; et al.	2003-09-25
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate App 20030078173 - Wojtczak, William A. ; et al.	2003-04-24
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures App 20020132744 - Wojtczak, William A. ; et al.	2002-09-19
Post plasma ashing wafer cleaning formulation App 20020068685 - Wojtczak, William A. ; et al.	2002-06-06
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures Grant 6,344,432 - Wojtczak , et al. February 5, 2	2002-02-05
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures App 20020013238 - Wojtczak, William A. ; et al.	2002-01-31
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate App 20010050350 - Wojtczak, William A. ; et al.	2001-12-13

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.