| Patent | Date |
|---|
Integrated Circuit Package Redistribution Layers With Metal-insulator-metal (mim) Capacitors
App 20220310777 - O'Sullivan; David ; et al. | 2022-09-29 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same
Grant 11,456,116 - Augustin , et al. September 27, 2 | 2022-09-27 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20220294115 - Augustin; Andreas ; et al. | 2022-09-15 |
Wafer level package structure with internal conductive layer
Grant 11,424,209 - Albers , et al. August 23, 2 | 2022-08-23 |
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus
App 20220238440 - SEIDEMANN; Georg ; et al. | 2022-07-28 |
Patch antennas stitched to systems in packages and methods of assembling same
Grant 11,374,323 - Augustin , et al. June 28, 2 | 2022-06-28 |
Assembly Of 2xd Module Using High Density Interconnect Bridges
App 20220199562 - WAIDHAS; Bernd ; et al. | 2022-06-23 |
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus
App 20220115323 - SEIDEMANN; Georg ; et al. | 2022-04-14 |
Package Stacking Using Chip To Wafer Bonding
App 20220108976 - SEIDEMANN; Georg ; et al. | 2022-04-07 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus
Grant 11,270,941 - Seidemann , et al. March 8, 2 | 2022-03-08 |
Package stacking using chip to wafer bonding
Grant 11,239,199 - Seidemann , et al. February 1, 2 | 2022-02-01 |
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same
App 20220015244 - Seidemann; Georg ; et al. | 2022-01-13 |
Vertical and lateral interconnects between dies
Grant 11,177,220 - Seidemann , et al. November 16, 2 | 2021-11-16 |
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
Grant 11,145,577 - Koller , et al. October 12, 2 | 2021-10-12 |
Printed wiring-board islands for connecting chip packages and methods of assembling same
Grant 11,134,573 - Seidemann , et al. September 28, 2 | 2021-09-28 |
Semiconductor inductors
Grant 11,127,813 - Seidemann , et al. September 21, 2 | 2021-09-21 |
Antenna With Graded Dielectirc And Method Of Making The Same
App 20210273342 - Maruthamuthu; Saravana ; et al. | 2021-09-02 |
Interconnect structure for stacked die in a microelectronic device
Grant 11,107,763 - Wagner , et al. August 31, 2 | 2021-08-31 |
Method of providing partial electrical shielding
Grant 11,081,541 - Sciriha , et al. August 3, 2 | 2021-08-03 |
Stress Relief Die Implementation
App 20210193594 - STOECKL; Stephan ; et al. | 2021-06-24 |
Antenna with graded dielectirc and method of making the same
Grant 11,031,699 - Maruthamuthu , et al. June 8, 2 | 2021-06-08 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 11,018,114 - Waidhas , et al. May 25, 2 | 2021-05-25 |
Semiconductor die package with more than one hanging die
Grant 10,854,590 - Albers , et al. December 1, 2 | 2020-12-01 |
Printed Wiring-board Islands For Connecting Chip Packages And Methods Of Assembling Same
App 20200352035 - Seidemann; Georg ; et al. | 2020-11-05 |
Integrated circuit packages including an optical redistribution layer
Grant 10,816,742 - Seidemann , et al. October 27, 2 | 2020-10-27 |
Embedded-bridge Substrate Connectors And Methods Of Assembling Same
App 20200328182 - WAIDHAS; Bernd ; et al. | 2020-10-15 |
Method To Implement Wafer-level Chip-scale Packages With Grounded Conformal Shield
App 20200312781 - SIGNORINI; Gianni ; et al. | 2020-10-01 |
Method Of Providing Partial Electrical Shielding
App 20200286982 - Sciriha; Veronica ; et al. | 2020-09-10 |
Wafer Level Package Structure With Internal Conductive Layer
App 20200273832 - ALBERS; Sven ; et al. | 2020-08-27 |
Embedded-bridge substrate connectors and methods of assembling same
Grant 10,727,197 - Waidhas , et al. | 2020-07-28 |
Semiconductor Packages, and Methods for Forming Semiconductor Packages
App 20200227388 - Waidhas; Bernd ; et al. | 2020-07-16 |
Integrated circuit package assemblies including a chip recess
Grant 10,714,455 - Seidemann , et al. | 2020-07-14 |
Method of providing partial electrical shielding
Grant 10,700,159 - Sciriha , et al. | 2020-06-30 |
Semiconductor Inductors
App 20200185490 - Seidemann; Georg ; et al. | 2020-06-11 |
Semiconductor Die Package With More Than One Hanging Die
App 20200176436 - ALBERS; Sven ; et al. | 2020-06-04 |
Wafer level package structure with internal conductive layer
Grant 10,672,731 - Albers , et al. | 2020-06-02 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device
Grant 10,658,201 - Koller , et al. | 2020-05-19 |
Interposer with conductive routing exposed on sidewalls
Grant 10,651,102 - Reingruber , et al. | 2020-05-12 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20200144723 - Augustin; Andreas ; et al. | 2020-05-07 |
Vertical And Lateral Interconnects Between Dies
App 20200126922 - Seidemann; Georg ; et al. | 2020-04-23 |
Power mesh-on-die trace bumping
Grant 10,629,731 - Waidhas , et al. | 2020-04-21 |
Magnetic Coils In Locally Thinned Silicon Bridges And Methods Of Assembling Same
App 20200111607 - Augustin; Andreas ; et al. | 2020-04-09 |
Novel Wafer Level Chip Scale Package (wlcsp), Flip-chip Chip Scale Package (fccsp), And Fan Out Shielding Concepts
App 20200098698 - PATTEN; Richard ; et al. | 2020-03-26 |
Package Devices Having A Ball Grid Array With Side Wall Contact Pads
App 20200066692 - WOLTER; Andreas ; et al. | 2020-02-27 |
Component Terminations For Semiconductor Packages
App 20200068711 - Wolter; Andreas ; et al. | 2020-02-27 |
Semiconductor package having a variable redistribution layer thickness
Grant 10,553,538 - Reingruber , et al. Fe | 2020-02-04 |
Device containing and method of providing carbon covered copper layer
Grant 10,546,826 - Seidemann Ja | 2020-01-28 |
Interconnect Structure For Stacked Die In A Microelectronic Device
App 20200020629 - Wagner; Thomas ; et al. | 2020-01-16 |
Device Containing And Method Of Providing Carbon Covered Copper Layer
App 20200006263 - Seidemann; Georg | 2020-01-02 |
Method Of Providing Partial Electrical Shielding
App 20200006244 - Sciriha; Veronica ; et al. | 2020-01-02 |
Through-silicon Via Pillars For Connecting Dice And Methods Of Assembling Same
App 20200006272 - Augustin; Andreas ; et al. | 2020-01-02 |
Electrical device and a method for forming an electrical device
Grant 10,522,485 - Geissler , et al. Dec | 2019-12-31 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 10,522,454 - Meyer , et al. Dec | 2019-12-31 |
Thermal Contacts At Periphery Of Integrated Circuit Packages
App 20190393125 - Koller; Sonja ; et al. | 2019-12-26 |
Packages Of Stacking Integrated Circuits
App 20190393191 - REINGRUBER; Klaus ; et al. | 2019-12-26 |
Vertical wire connections for integrated circuit package
Grant 10,490,527 - Geissler , et al. Nov | 2019-11-26 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190341371 - Waidhas; Bernd ; et al. | 2019-11-07 |
Interconnect Structure For A Microelectronic Device
App 20190333886 - Reingruber; Klaus ; et al. | 2019-10-31 |
Advanced node cost reduction by ESD interposer
Grant 10,446,541 - Seidemann , et al. Oc | 2019-10-15 |
Fan Out Packaging Pop Mechanical Attach Method
App 20190312016 - O'Sullivan; David ; et al. | 2019-10-10 |
Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same
Grant 10,431,545 - Seidemann , et al. O | 2019-10-01 |
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device
App 20190295857 - Koller; Sonja ; et al. | 2019-09-26 |
Bare-die Smart Bridge Connected With Copper Pillars For System-in-package Apparatus
App 20190287904 - Seidemann; Georg ; et al. | 2019-09-19 |
Microelectronic package with illuminated backside exterior
Grant 10,411,000 - Dittes , et al. Sept | 2019-09-10 |
System-in-package devices and methods for forming system-in-package devices
Grant 10,403,609 - Geissler , et al. Sep | 2019-09-03 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 10,403,602 - Waidhas , et al. Sep | 2019-09-03 |
Antenna With Graded Dielectirc And Method Of Making The Same
App 20190252792 - Maruthamuthu; Saravana ; et al. | 2019-08-15 |
Integrated circuit package configurations to reduce stiffness
Grant 10,373,844 - Albers , et al. | 2019-08-06 |
Interconnect structure for a microelectronic device
Grant 10,366,968 - Reingruber , et al. July 30, 2 | 2019-07-30 |
Systems, Methods, And Apparatuses For Implementing Reduced Height Semiconductor Packages For Mobile Electronics
App 20190214369 - SEIDEMANN; Georg ; et al. | 2019-07-11 |
Low thermal resistance hanging die package
Grant 10,347,558 - Geissler , et al. July 9, 2 | 2019-07-09 |
Power Mesh-on-die Trace Bumping
App 20190207027 - Waidhas; Bernd ; et al. | 2019-07-04 |
Eplb/ewlb Based Pop For Hbm Or Customized Package Stack
App 20190206833 - MEYER; Thorsten ; et al. | 2019-07-04 |
Anisotropically Conductive Elastic Adhesive Films In Semiconductor Device Packages And Methods Of Assembling Same
App 20190198448 - Koller; Sonja ; et al. | 2019-06-27 |
Antenna on ceramics for a packaged die
Grant 10,319,688 - Wolter , et al. | 2019-06-11 |
Optical Fiber Connection On Package Edge
App 20190121041 - Albers; Sven ; et al. | 2019-04-25 |
Power mesh-on-die trace bumping
Grant 10,263,106 - Waidhas , et al. | 2019-04-16 |
Integrated Circuit Package Assemblies Including A Chip Recess
App 20190109120 - Seidemann; Georg ; et al. | 2019-04-11 |
Electronic Component Alignment Device And Method
App 20190103347 - Seidemann; Georg ; et al. | 2019-04-04 |
Flexible band wearable electronic device
Grant 10,228,725 - Albers , et al. | 2019-03-12 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20190072732 - Seidemann; Georg ; et al. | 2019-03-07 |
Integrated circuit packages including an optical redistribution layer
Grant 10,209,466 - Seidemann , et al. Feb | 2019-02-19 |
Semiconductor Package Having A Variable Redistribution Layer Thickness
App 20190043800 - REINGRUBER; Klaus Jurgen ; et al. | 2019-02-07 |
Integrated circuit package assemblies including a chip recess
Grant 10,186,499 - Seidemann , et al. Ja | 2019-01-22 |
Smart Accelerometer Cantilever
App 20190004083 - Koller; Sonja ; et al. | 2019-01-03 |
Cross-connected Multi-chip Modules Coupled By Silicon Bent-bridge Interconnects And Methods Of Assembling Same
App 20190006281 - Seidemann; Georg ; et al. | 2019-01-03 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190006318 - Waidhas; Bernd ; et al. | 2019-01-03 |
Vertical Wire Connections For Integrated Circuit Package
App 20180374819 - Geissler; Christian ; et al. | 2018-12-27 |
Wafer Level Package Structure With Internal Conductive Layer
App 20180358317 - ALBERS; Sven ; et al. | 2018-12-13 |
Interposer With Conductive Routing Exposed On Sidewalls
App 20180342431 - Reingruber; Klaus ; et al. | 2018-11-29 |
Bent-bridge semiconductive apparatus
Grant 10,141,265 - Waidhas , et al. Nov | 2018-11-27 |
Package Stacking Using Chip To Wafer Bonding
App 20180331070 - SEIDEMANN; Georg ; et al. | 2018-11-15 |
System-in-Package Devices and Methods for Forming System-in-Package Devices
App 20180331080 - Geissler; Christian ; et al. | 2018-11-15 |
Electrical device and a method for forming an electrical device
App 20180331053 - GEISSLER; Christian ; et al. | 2018-11-15 |
Cooler for semiconductor devices
Grant 10,121,726 - Albers , et al. November 6, 2 | 2018-11-06 |
Semiconductor package having a variable redistribution layer thickness
Grant 10,115,668 - Reingruber , et al. October 30, 2 | 2018-10-30 |
Filler Interface Heat Transfer System And Devices And Methods For Same
App 20180284851 - Seidemann; Georg ; et al. | 2018-10-04 |
Power Mesh-on-die Trace Bumping
App 20180286798 - Waidhas; Bernd ; et al. | 2018-10-04 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20180286799 - MEYER; Thorsten ; et al. | 2018-10-04 |
Device with switchable heat path
Grant 10,091,866 - Koller , et al. October 2, 2 | 2018-10-02 |
Embedded-bridge Substrate Connectors And Methods Of Assembling Same
App 20180277512 - Waidhas; Bernd ; et al. | 2018-09-27 |
Robust Intermetallic Compound Layer Interface For Package In Package Embedding
App 20180226377 - GEISSLER; Christian ; et al. | 2018-08-09 |
Low Thermal Resistance Hanging Die Package
App 20180218962 - GEISSLER; Christian ; et al. | 2018-08-02 |
Advanced Node Cost Reduction By Esd Interposer
App 20180204831 - SEIDEMANN; Georg ; et al. | 2018-07-19 |
Bent-bridge Semiconductive Apparatus
App 20180190589 - Waidhas; Bernd ; et al. | 2018-07-05 |
Device With Switchable Heat Path
App 20180177037 - Koller; Sonja ; et al. | 2018-06-21 |
Microelectronic package having a passive microelectronic device disposed within a package body
Grant 9,997,444 - Meyer , et al. June 12, 2 | 2018-06-12 |
Wearable Computing Device
App 20180150156 - Albers; Sven ; et al. | 2018-05-31 |
Flexible Band Wearable Electronic Device
App 20180095426 - Albers; Sven ; et al. | 2018-04-05 |
Interconnect Structure For A Microelectronic Device
App 20180096970 - Reingruber; Klaus ; et al. | 2018-04-05 |
Flexible Band Wearable Electronic Device
App 20180092443 - Albers; Sven ; et al. | 2018-04-05 |
Wearable computing device
Grant 9,921,694 - Albers , et al. March 20, 2 | 2018-03-20 |
Integrated Circuit Package Assemblies Including A Chip Recess
App 20180005991 - Seidemann; Georg ; et al. | 2018-01-04 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20170345678 - Albers; Sven ; et al. | 2017-11-30 |
Bulk acoustic wave resonator tuner circuits
Grant 9,819,327 - Maruthamuthu , et al. November 14, 2 | 2017-11-14 |
Integrated Circuit Packages Including An Optical Redistribution Layer
App 20170285280 - Seidemann; Georg ; et al. | 2017-10-05 |
Microelectronic Package with Illuminated Backside Exterior
App 20170284636 - Dittes; Marc Stephan ; et al. | 2017-10-05 |
Semiconductor Package Having A Variable Redistribution Layer Thickness
App 20170170111 - REINGRUBER; Klaus Jurgen ; et al. | 2017-06-15 |
Integrated circuit package configurations to reduce stiffness
Grant 9,653,324 - Albers , et al. May 16, 2 | 2017-05-16 |
Magnetic contacts
Grant 9,601,468 - Skinner , et al. March 21, 2 | 2017-03-21 |
Cooler For Semiconductor Devices
App 20170062306 - Albers; Sven ; et al. | 2017-03-02 |
Microelectronic Package Having A Passive Microelectronic Device Disposed Within A Package Body
App 20160358848 - Meyer; Thorsten ; et al. | 2016-12-08 |
Stacked Semiconductor Device Package With Improved Interconnect Bandwidth
App 20160329272 - GEISSLER; Christian ; et al. | 2016-11-10 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20160293453 - Albers; Sven ; et al. | 2016-10-06 |
Magnetic Contacts
App 20160247785 - Skinner; Michael P. ; et al. | 2016-08-25 |
Antenna On Ceramics For A Packaged Die
App 20160240492 - Wolter; Andreas ; et al. | 2016-08-18 |
Wearable Computing Device
App 20160224148 - ALBERS; Sven ; et al. | 2016-08-04 |
Integrated circuit package configurations to reduce stiffness
Grant 9,397,019 - Albers , et al. July 19, 2 | 2016-07-19 |
Device and Method for Stopping an Etching Process
App 20160197009 - Brencher; Lothar ; et al. | 2016-07-07 |
Contact pads for integrated circuit packages
Grant 9,368,461 - Albers , et al. June 14, 2 | 2016-06-14 |
Magnetic contacts
Grant 9,343,389 - Skinner , et al. May 17, 2 | 2016-05-17 |
Device and method for stopping etching process
Grant 9,305,798 - Brencher , et al. April 5, 2 | 2016-04-05 |
Magnetic Contacts
App 20150357311 - Skinner; Michael P. ; et al. | 2015-12-10 |
Die edge side connection
Grant 9,209,143 - Seidemann , et al. December 8, 2 | 2015-12-08 |
Bulk Acoustic Wave Resonator Tuner Circuits
App 20150333401 - Maruthamuthu; Saravana ; et al. | 2015-11-19 |
Contact Pads For Integrated Circuit Packages
App 20150333022 - Albers; Sven ; et al. | 2015-11-19 |
Magnetic contacts
Grant 9,142,475 - Skinner , et al. September 22, 2 | 2015-09-22 |
Integrated Circuit Package Configurations To Reduce Stiffness
App 20150243572 - Albers; Sven ; et al. | 2015-08-27 |
Die Edge Side Connection
App 20150084202 - Seidemann; Georg ; et al. | 2015-03-26 |
Magnetic Contacts
App 20150048520 - Skinner; Michael P. ; et al. | 2015-02-19 |
Semiconductor device with capacitive coupling structure
Grant 8,779,564 - Knudsen , et al. July 15, 2 | 2014-07-15 |
Device and Method for Stopping Etching Process
App 20130288481 - Brencher; Lothar ; et al. | 2013-10-31 |
Device and method for stopping an etching process
Grant 8,404,597 - Brencher , et al. March 26, 2 | 2013-03-26 |
Bonding pad for contacting a device
Grant 7,816,791 - Ahrens , et al. October 19, 2 | 2010-10-19 |
Method for producing an integrated circuit including a fuse element, a fuse-memory element or a resistor element
Grant 7,682,958 - Seidemann , et al. March 23, 2 | 2010-03-23 |
Integrated circuit, method for acquiring data and measurement system
Grant 7,660,175 - Kohlert , et al. February 9, 2 | 2010-02-09 |
Integrated Circuit, Method for Acquiring Data and Measurement System
App 20090219773 - Kohlert; Dieter ; et al. | 2009-09-03 |
Bonding Pad for Contacting a Device
App 20080067682 - Ahrens; Carsten ; et al. | 2008-03-20 |
Method For Producing An Integrated Circuit Including A Fuse Element, A Fuse-memory Element Or A Resistor Element
App 20080029477 - Seidemann; Georg ; et al. | 2008-02-07 |
| 