Segawa; Tadanori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Segawa; Tadanori.The latest application filed is for "wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate".

Company Profile

0.9.5

Segawa; Tadanori - Hitachi JP
Segawa, Tadanori - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate Grant 7,535,106 - Shiono , et al. May 19, 2	2009-05-19
Semiconductor device and manufacturing method thereof Grant 7,378,333 - Satoh , et al. May 27, 2	2008-05-27
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate App 20070114653 - Shiono; Osamu ; et al.	2007-05-24
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 7,217,992 - Ogino , et al. May 15, 2	2007-05-15
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate Grant 7,183,650 - Shiono , et al. February 27, 2	2007-02-27
Semiconductor device and manufacturing method thereof App 20050245061 - Satoh, Toshiya ; et al.	2005-11-03
Semiconductor device and manufacturing method thereof Grant 6,946,723 - Satoh , et al. September 20, 2	2005-09-20
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 6,888,230 - Ogino , et al. May 3, 2	2005-05-03
Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor App 20040217455 - Shiono, Osamu ; et al.	2004-11-04
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device App 20040217453 - Ogino, Masahiko ; et al.	2004-11-04
Semiconductor apparatus having stress cushioning layer Grant 6,621,154 - Satoh , et al. September 16, 2	2003-09-16
Semiconductor device and manufacturing method thereof App 20020025655 - Satoh, Toshiya ; et al.	2002-02-28
Resin encapsulated semiconductor device Grant 4,965,657 - Ogata , et al. October 23, 1	1990-10-23
Resin encapsulated electronic devices Grant 4,933,744 - Segawa , et al. June 12, 1	1990-06-12

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.