Segawa; Shigetoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Segawa; Shigetoshi.The latest application filed is for "substrate for light-emitting element, method for manufacturing the same and light-emitting device".
- Segawa; Shigetoshi - Ehime N/A JP
- Segawa; Shigetoshi - Niihama JP
- Segawa, Shigetoshi - Nihama-shi JP
| Patent | Date |
|---|---|
| Substrate for mounting light-emitting element and light-emitting device Grant 9,076,714 - Nakatani , et al. July 7, 2 | 2015-07-07 |
| Substrate For Light-emitting Element, Method For Manufacturing The Same And Light-emitting Device App 20120319159 - Nakatani; Seiichi ; et al. | 2012-12-20 |
| Hybrid Substrate And Method For Producing The Same App 20110293874 - TOYOOKA; Takashi ; et al. | 2011-12-01 |
| Circuit module and manufacturing method thereof Grant 8,003,438 - Morimoto , et al. August 23, 2 | 2011-08-23 |
| Circuit module and manufacturing method thereof App 20080090335 - Morimoto; Kenji ; et al. | 2008-04-17 |
| Production method of circuit board module Grant 6,942,745 - Segawa September 13, 2 | 2005-09-13 |
| Circuit board App 20050029011 - Morita, Toshifumi ; et al. | 2005-02-10 |
| Circuit module and manufacturing method thereof App 20050017347 - Morimoto, Kenji ; et al. | 2005-01-27 |
| Method of producing ceramic multi-layered substrate Grant 6,740,183 - Segawa , et al. May 25, 2 | 2004-05-25 |
| Sheet retainer for punching ceramic green sheet and punching apparatus Grant 6,647,845 - Ochi , et al. November 18, 2 | 2003-11-18 |
| Method of manufacturing a circuit board using a porous sheet composed of cellulose Grant 6,598,292 - Segawa , et al. July 29, 2 | 2003-07-29 |
| Production method of circuit board module App 20030034127 - Segawa, Shigetoshi | 2003-02-20 |
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