Segawa; Masanori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Segawa; Masanori.The latest application filed is for "brake apparatus, brake control method, and method for determining lock abnormality in motor".

Company Profile

0.20.9

Segawa; Masanori - Machida JP
SEGAWA; Masanori - Machida-shi Tokyo
Segawa; Masanori - Hitachi JP
Segawa, Masanori - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Brake apparatus, brake control method, and method for determining lock abnormality in motor Grant 11,453,372 - Segawa September 27, 2	2022-09-27
Brake Apparatus, Brake Control Method, And Method For Determining Lock Abnormality In Motor App 20190061724 - SEGAWA; Masanori	2019-02-28
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same Grant 7,202,570 - Nagai , et al. April 10, 2	2007-04-10
Wiring tape for semiconductor device including a buffer layer having interconnected foams Grant 7,038,325 - Ogino , et al. May 2, 2	2006-05-02
Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2	2005-07-19
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same App 20040224149 - Nagai, Akira ; et al.	2004-11-11
Wiring tape for semiconductor device including a buffer layer having interconnected foams App 20040195702 - Ogino, Masahiko ; et al.	2004-10-07
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Grant 6,791,194 - Nagai , et al. September 14, 2	2004-09-14
Semiconductor device App 20040155323 - Murakami, Gen ; et al.	2004-08-12
Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2	2004-04-13
Semiconductor device App 20030127712 - Murakami, Gen ; et al.	2003-07-10
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same App 20020160185 - Nagai, Akira ; et al.	2002-10-31
Semiconductor device and wiring tape for semiconductor device App 20020158343 - Ogino, Masahiko ; et al.	2002-10-31
Method of making a semiconductor device having a stress relieving mechanism Grant 6,423,571 - Ogino , et al. July 23, 2	2002-07-23
Method of making a semiconductor device having a stress relieving mechanism App 20010051393 - Ogino, Masahiko ; et al.	2001-12-13
Semiconductor device App 20010008302 - Murakami, Gen ; et al.	2001-07-19
Laminate and multilayer printed circuit board Grant 6,114,005 - Nagai , et al. September 5, 2	2000-09-05
Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2	2000-08-08
Resin sealed semiconductor devices and a process for manufacturing the same Grant 6,097,100 - Eguchi , et al. August 1, 2	2000-08-01
Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2	2000-06-27
Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2	2000-05-30
Semiconductor device having a stress relieving mechanism Grant 6,028,364 - Ogino , et al. February 22, 2	2000-02-22
Laminate and multilayer printed circuit board Grant 5,677,045 - Nagai , et al. October 14, 1	1997-10-14
Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1	1997-03-18
Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1	1996-06-25
Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1	1994-10-25
Resin composition for encapsulating of semiconductor and semiconductor apparatus using of the same Grant 5,225,499 - Kokaku , et al. July 6, 1	1993-07-06
Plastic molded type electronic device Grant 5,181,097 - Ogata , et al. January 19, 1	1993-01-19
Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1	1991-11-26

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