Segawa; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Segawa; Daisuke.The latest application filed is for "method for forming multilayer coating film".
- Segawa; Daisuke - Hirakata JP
- SEGAWA; Daisuke - Hirakata-shi Osaka
- Segawa; Daisuke - Osaka JP
- Segawa; Daisuke - Ibaraki-shi Osaka
- Segawa, Daisuke - Osaka-fu JP
- Segawa, Daisuke - Yokohama-shi JP
| Patent | Date |
|---|---|
| Method for forming multilayer coating film Grant 10,695,793 - Oka , et al. | 2020-06-30 |
| Method for forming multilayer coating film Grant 10,696,866 - Oka , et al. June 30, 2 | 2020-06-30 |
| Method For Forming Multilayer Coating Film App 20190030563 - OKA; Miho ; et al. | 2019-01-31 |
| Method For Forming Multilayer Coating Film App 20190031915 - OKA; Miho ; et al. | 2019-01-31 |
| Water Dispersible Resin, Two-component Thermosetting Resin Composition, And Method Of Producing The Same App 20090234074 - Segawa; Daisuke ; et al. | 2009-09-17 |
| Method for producing top coating film and clear coating composition App 20080213484 - Segawa; Daisuke ; et al. | 2008-09-04 |
| Water-based intercoating composition and method of forming multilayered coating film App 20060121204 - Nakae; Yasukiho ; et al. | 2006-06-08 |
| Method for forming plural-layered coated film App 20040228975 - Takesako, Shoichi ; et al. | 2004-11-18 |
| Method of forming metallic coating films App 20010024694 - Yoneda, Hiroto ; et al. | 2001-09-27 |
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