Sedivy; Jordan L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sedivy; Jordan L..The latest application filed is for "multi-manifold extrusion die with deckle system and method of using same".
- Sedivy; Jordan L. - Chippewa Falls WI
| Patent | Date |
|---|---|
| Multi-manifold extrusion die with deckle system and method of using same Grant 10,040,234 - Sedivy August 7, 2 | 2018-08-07 |
| Multi-Manifold Extrusion Die with Deckle System and Method of Using Same App 20150343690 - Sedivy; Jordan L. | 2015-12-03 |
| Extrusion die with deckle system and methods of using same Grant 9,132,580 - Sedivy September 15, 2 | 2015-09-15 |
| Extrusion Die With Deckle System And Methods Of Using Same App 20150104537 - Sedivy; Jordan L. | 2015-04-16 |
| Deckle technology Grant 9,004,903 - Oliver , et al. April 14, 2 | 2015-04-14 |
| Deckle Technology App 20140248390 - Oliver; Gary D. ; et al. | 2014-09-04 |
| Deckle technology Grant 8,777,605 - Ulcej , et al. July 15, 2 | 2014-07-15 |
| Extrusion Dies with Internal And/Or External Deckles App 20130122131 - Sedivy; Jordan L. ; et al. | 2013-05-16 |
| Deckle Technology App 20110206795 - Ulcej; John A. ; et al. | 2011-08-25 |
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