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name:-0.0047378540039062
name:-0.010452032089233
name:-0.00050997734069824
Sebesta; Robert David Patent Filings

Sebesta; Robert David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sebesta; Robert David.The latest application filed is for "variable thickness pads on a substrate surface".

Company Profile
0.8.4
  • Sebesta; Robert David - Endicott NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Structure having flush circuit features and method of making
Grant 7,098,136 - Clothier , et al. August 29, 2
2006-08-29
Variable thickness pads on a substrate surface
Grant 6,989,297 - Sebesta , et al. January 24, 2
2006-01-24
Variable thickness pads on a substrate surface
Grant 6,900,545 - Sebesta , et al. May 31, 2
2005-05-31
Variable thickness pads on a substrate surface
App 20050023703 - Sebesta, Robert David ;   et al.
2005-02-03
Structure having flush circuit features and method of making
App 20050020079 - Clothier, Ronald ;   et al.
2005-01-27
Structure having flush circuitry features and method of making
Grant 6,815,709 - Clothier , et al. November 9, 2
2004-11-09
Apparatus and method for compensating for distortion of a printed circuit workpiece substrate
Grant 6,580,491 - Hall , et al. June 17, 2
2003-06-17
Method and system of distortion compensation in a projection imaging expose system
Grant 6,580,494 - Hall , et al. June 17, 2
2003-06-17
Structure having flush circuitry features and method of making
App 20020177006 - Clothier, Ronald ;   et al.
2002-11-28
Apparatus and method for compensating for distortion of a printed circuit workpiece substrate
App 20020085188 - Hall, Richard Ronald ;   et al.
2002-07-04
Process for fabricating circuitry on substrates having plated through-holes
Grant 6,013,417 - Sebesta , et al. January 11, 2
2000-01-11
Process for connecting an electrical device to a circuit substrate
Grant 5,712,192 - Lewis , et al. January 27, 1
1998-01-27

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