SEARLS; Damion

Patent Applications and Registrations

Patent applications and USPTO patent grants for SEARLS; Damion.The latest application filed is for "liquid cooling system leak detection improvements".

Company Profile

5.15.17

SEARLS; Damion - Portland OR
Searls; Damion - Hillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid Cooling System Leak Detection Improvements App 20220196507 - SUBRAHMANYAM; Prabhakar ; et al.	2022-06-23
Add-in Card Having High Performance Semiconductor Chip Packages With Dedicated Heat App 20220113773 - MA; Lunyu ; et al.	2022-04-14
Mainboard assembly including a package overlying a die directly attached to the mainboard Grant 10,555,417 - Searls , et al. Fe	2020-02-04
Mainboard Assembly Including A Package Overlying A Die Directly Attached To The Mainboard App 20190182958 - SEARLS; Damion ; et al.	2019-06-13
Mainboard assembly including a package overlying a die directly attached to the mainboard Grant 10,251,273 - Searls , et al.	2019-04-02
Method for reducing loadline impedance in a system Grant 8,659,909 - Searls , et al. February 25, 2	2014-02-25
Low Profile Solder Grid Array Technology For Printed Circuit Board Surface Mount Components App 20120224331 - Roth; Weston ; et al.	2012-09-06
Mainboard assembly including a package overlying a die directly attached to the mainboard App 20100061056 - Searls; Damion ; et al.	2010-03-11
Low profile solder grid array technology for printed circuit board surface mount components App 20090310320 - Roth; Weston ; et al.	2009-12-17
Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board App 20090051004 - Roth; Weston C. ; et al.	2009-02-26
Capacitor placement for integrated circuit packages Grant 7,230,317 - Pearson , et al. June 12, 2	2007-06-12
Reducing loadline impedance in a system App 20070074389 - Searls; Damion ; et al.	2007-04-05
Reducing loadline impedance in a system Grant 7,145,782 - Searls , et al. December 5, 2	2006-12-05
Method of mounting a substrate to a motherboard App 20060203459 - Morgan; Thomas O. ; et al.	2006-09-14
Circuit board with added impedance Grant 7,057,114 - Dishongh , et al. June 6, 2	2006-06-06
Capacitor placement for integrated circuit packages App 20060049479 - Pearson; Tom E. ; et al.	2006-03-09
Reducing loadline impedance in a system App 20060014444 - Searls; Damion ; et al.	2006-01-19
Channeled heat dissipation device and a method of fabrication Grant 6,906,921 - Searls , et al. June 14, 2	2005-06-14
Electronic assembly with thermally separated support Grant 6,903,271 - Pearson , et al. June 7, 2	2005-06-07
Socket with multiple contact pad area socket contacts Grant 6,884,087 - Searls , et al. April 26, 2	2005-04-26
Electronic Assembly With Thermally Separated Support App 20050067178 - Pearson, Tom E. ; et al.	2005-03-31
Socket With Multiple Contact Pad Area Socket Contacts App 20050064739 - Searls, Damion ; et al.	2005-03-24
Metallurgically enhanced heat sink Grant 6,797,085 - Dishongh , et al. September 28, 2	2004-09-28
Channeled heat dissipation device and a method of fabrication App 20040179336 - Searls, Damion ; et al.	2004-09-16
Circuit board with added impedance Grant 6,775,122 - Dishongh , et al. August 10, 2	2004-08-10
Iodine-containing thermal interface material Grant 6,752,204 - Dishongh , et al. June 22, 2	2004-06-22
Channeled heat dissipation device and a method of fabrication Grant 6,747,873 - Searls , et al. June 8, 2	2004-06-08
Circuit board with added impedance App 20040057184 - Dishongh, Terry ; et al.	2004-03-25
Iodine-containing thermal interface material App 20030051868 - Dishongh, Terrance J. ; et al.	2003-03-20
Ergonomic auxiliary screen and display subsystem for portable handheld devices App 20030006942 - Searls, Damion ; et al.	2003-01-09

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