Seantumpol; Pitak
Patent Applications and Registrations
Patent applications and USPTO patent grants for Seantumpol; Pitak.The latest application filed is for "non-leaded device singulation".
- Seantumpol; Pitak - Pathumthani TH
- Seantumpol; Pitak - Bangkok TH
| Patent | Date |
|---|---|
| Die separation using adhesive-layer laser scribing Grant 10,607,861 - Wongratanaporngoorn , et al. | 2020-03-31 |
| Non-leaded Device Singulation App 20190252256 - Boonyatee; Pimpa ; et al. | 2019-08-15 |
| Die Separation Using Adhesive-layer Laser Scribing App 20190164784 - Wongratanaporngoorn; Siriluck ; et al. | 2019-05-30 |
| Semiconductor wafer dicing method Grant 10,297,500 - Lictao, Jr. , et al. | 2019-05-21 |
| Semiconductor Wafer Dicing Method App 20180174907 - Lictao, JR.; Crispulo Estira ; et al. | 2018-06-21 |
| Method of assembling semiconductor devices of varying thicknesses Grant 9,812,339 - Boonyatee , et al. November 7, 2 | 2017-11-07 |
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