Schwizer; Jurg
Patent Applications and Registrations
Patent applications and USPTO patent grants for Schwizer; Jurg.The latest application filed is for "method for determining optimum bonding parameters for bonding with a wire bonder".
- Schwizer; Jurg - Pfaffnau CH
| Patent | Date |
|---|---|
| Method for determining optimum bonding parameters for bonding with a wire bonder Grant 6,929,168 - Mayer , et al. August 16, 2 | 2005-08-16 |
| Method for the calibration of a wire bonder Grant 6,648,205 - Mayer , et al. November 18, 2 | 2003-11-18 |
| Method for determining optimum bonding parameters for bonding with a wire bonder App 20030146265 - Mayer, Michael ; et al. | 2003-08-07 |
| Method for the calibration of a wire bonder App 20030080176 - Mayer, Michael ; et al. | 2003-05-01 |
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