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Patent applications and USPTO patent grants for Schwarz; Mark Wendell.The latest application filed is for "soldering relief method and semiconductor device employing same".
Patent | Date |
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Soldering relief method and semiconductor device employing same Grant 8,841,168 - Schwarz , et al. September 23, 2 | 2014-09-23 |
Soldering Relief Method And Semiconductor Device Employing Same App 20130244384 - Schwarz; Mark Wendell ;   et al. | 2013-09-19 |
Soldering relief method and semiconductor device employing same Grant 8,461,676 - Schwarz , et al. June 11, 2 | 2013-06-11 |
Soldering Relief Method and Semiconductor Device Employing Same App 20130062746 - Schwarz; Mark Wendell ;   et al. | 2013-03-14 |
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