loadpatents
Patent applications and USPTO patent grants for Schwandner; Juergen.The latest application filed is for "method for the double-side polishing of a semiconductor wafer".
Patent | Date |
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Method for polishing a semiconductor wafer Grant 10,707,069 - Schwandner , et al. | 2020-07-07 |
Method for the local polishing of a semiconductor wafer Grant 9,533,394 - Schwandner January 3, 2 | 2017-01-03 |
Method for the double-side polishing of a semiconductor wafer Grant 9,308,619 - Schwandner April 12, 2 | 2016-04-12 |
Method for polishing both sides of a semiconductor wafer Grant 9,224,613 - Schwandner December 29, 2 | 2015-12-29 |
Method for polishing a semiconductor material wafer Grant 9,193,026 - Schwandner November 24, 2 | 2015-11-24 |
Method For The Double-side Polishing Of A Semiconductor Wafer App 20140370786 - Schwandner; Juergen | 2014-12-18 |
Method for polishing a semiconductor wafer Grant 8,882,565 - Schwandner , et al. November 11, 2 | 2014-11-11 |
Method For Polishing A Semiconductor Material Wafer App 20140287656 - Schwandner; Juergen | 2014-09-25 |
Method for the double-side polishing of a semiconductor wafer Grant 8,721,390 - Schwandner , et al. May 13, 2 | 2014-05-13 |
Method for producing a semiconductor wafer Grant 8,685,270 - Schwandner , et al. April 1, 2 | 2014-04-01 |
Method for polishing a substrate composed of semiconductor material Grant 8,647,985 - Schwandner , et al. February 11, 2 | 2014-02-11 |
Method for polishing a semiconductor wafer Grant 8,647,173 - Schwandner , et al. February 11, 2 | 2014-02-11 |
Method for producing an epitaxially coated semiconductor wafer Grant 8,551,870 - Schwandner , et al. October 8, 2 | 2013-10-08 |
Method for producing a semiconductor wafer Grant 8,529,315 - Schwandner , et al. September 10, 2 | 2013-09-10 |
Method for polishing a semiconductor wafer Grant 8,500,516 - Schwandner August 6, 2 | 2013-08-06 |
Method for grinding a semiconductor wafer Grant 8,501,028 - Schwandner August 6, 2 | 2013-08-06 |
Method For Polishing A Semiconductor Wafer App 20130189904 - Schwandner; Juergen ;   et al. | 2013-07-25 |
Polishing Pad and Method For Polishing A Semiconductor Wafer App 20130157543 - Schwandner; Juergen ;   et al. | 2013-06-20 |
Polishing pad and method for polishing a semiconductor wafer Grant 8,444,455 - Schwandner , et al. May 21, 2 | 2013-05-21 |
Method For The Double-side Polishing Of A Semiconductor Wafer App 20130072091 - Schwandner; Juergen | 2013-03-21 |
Method for producing a semiconductor wafer Grant 8,389,409 - Schwandner March 5, 2 | 2013-03-05 |
Method for polishing the edge of a semiconductor wafer Grant 8,388,411 - Schwandner March 5, 2 | 2013-03-05 |
Method for chemically grinding a semiconductor wafer on both sides Grant 8,376,810 - Schwandner February 19, 2 | 2013-02-19 |
Method for the double sided polishing of a semiconductor wafer Grant 8,376,811 - Schwandner February 19, 2 | 2013-02-19 |
Method for producing a semiconductor wafer Grant 8,343,873 - Schwandner January 1, 2 | 2013-01-01 |
Method for polishing a semiconductor wafer with a strained-relaxed Si.sub.1-xGe.sub.x layer Grant 8,338,302 - Schwandner , et al. December 25, 2 | 2012-12-25 |
Method For Producing A Semiconductor Wafer App 20120149198 - Schwandner; Juergen | 2012-06-14 |
Method For Polishing A Semiconductor Wafer App 20110244760 - Schwandner; Juergen ;   et al. | 2011-10-06 |
Method For The Double-side Polishing Of A Semiconductor Wafer App 20110244762 - Schwandner; Juergen ;   et al. | 2011-10-06 |
Method For Polishing A Semiconductor Wafer App 20110223841 - Schwandner; Juergen ;   et al. | 2011-09-15 |
Method For Producing A Semiconductor Wafer App 20110183582 - Schwandner; Juergen ;   et al. | 2011-07-28 |
Method For Producing A Semiconductor Wafer App 20110133314 - Pietsch; Georg ;   et al. | 2011-06-09 |
Method For Polishing A Semiconductor Wafer App 20110111677 - SCHWANDNER; Juergen | 2011-05-12 |
Method For Polishing A Semiconductor Wafer App 20110097974 - SCHWANDNER; Juergen ;   et al. | 2011-04-28 |
Method For Producing A Semiconductor Wafer App 20110097975 - SCHWANDNER; Juergen ;   et al. | 2011-04-28 |
Method For Polishing Semiconductor Wafers App 20110081840 - SCHWANDNER; Juergen | 2011-04-07 |
Method For Grinding A Semiconductor Wafer App 20110081836 - SCHWANDNER; Juergen | 2011-04-07 |
Method For The Double Sided Polishing Of A Semiconductor Wafer App 20100330881 - Schwandner; Juergen | 2010-12-30 |
Method For Producing A Semiconductor Wafer App 20100327414 - Schwandner; Juergen | 2010-12-30 |
Method For Polishing The Edge Of A Semiconductor Wafer App 20100330885 - Schwandner; Juergen | 2010-12-30 |
Method For The Local Polishing Of A Semiconductor Wafer App 20100330883 - Schwandner; Juergen | 2010-12-30 |
Method For Producing An Epitaxially Coated Semiconductor Wafer App 20100330786 - Schwandner; Juergen ;   et al. | 2010-12-30 |
Polishing Pad and Method For Polishing A Semiconductor Wafer App 20100330882 - Schwandner; Juergen ;   et al. | 2010-12-30 |
Method For Chemically Grinding A Semiconductor Wafer On Both Sides App 20100323585 - Schwandner; Juergen | 2010-12-23 |
Method For Polishing A Semiconductor Wafer With A Strained-Relaxed Si1-xGex Layer App 20100130012 - Schwandner; Juergen ;   et al. | 2010-05-27 |
Method For Polishing Both Sides Of A Semiconductor Wafer App 20100104806 - Schwandner; Juergen | 2010-04-29 |
Method For Polishing A Substrate Composed Of Semiconductor Material App 20090029552 - Schwandner; Juergen ;   et al. | 2009-01-29 |
Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx Layer App 20080265375 - Pietsch; Georg ;   et al. | 2008-10-30 |
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