Patent | Date |
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Wall construction and component for the same Grant 8,806,824 - Schwan August 19, 2 | 2014-08-19 |
SOI device with a buried insulating material having increased etch resistivity Grant 08617940 - | 2013-12-31 |
SOI device with a buried insulating material having increased etch resistivity Grant 8,617,940 - Kurz , et al. December 31, 2 | 2013-12-31 |
Methods of forming efuse devices Grant 8,609,485 - Kurz , et al. December 17, 2 | 2013-12-17 |
Electronic fuse structure formed using a metal gate electrode material stack configuration Grant 8,564,089 - Kurz , et al. October 22, 2 | 2013-10-22 |
Method of Forming a Semiconductor Device Comprising eFuses of Increased Programming Window App 20120164799 - Kurz; Andreas ;   et al. | 2012-06-28 |
Semiconductor device comprising a silicon/germanium resistor Grant 8,193,066 - Kurz , et al. June 5, 2 | 2012-06-05 |
Semiconductor device comprising isolation trenches inducing different types of strain Grant 8,138,571 - Schwan , et al. March 20, 2 | 2012-03-20 |
Method of creating a strained channel region in a transistor by deep implantation of strain-inducing species below the channel region Grant 8,110,487 - Griebenow , et al. February 7, 2 | 2012-02-07 |
SEMICONDUCTOR DEVICE COMPRISING HIGH-K METAL GATE ELECTRODE STRUCTURES AND eFUSES FORMED IN THE SEMICONDUCTOR MATERIAL App 20110241124 - Kurz; Andreas ;   et al. | 2011-10-06 |
Aluminum Fuses In A Semiconductor Device Comprising Metal Gate Electrode Structures App 20110241086 - Kurz; Andreas ;   et al. | 2011-10-06 |
Semiconductor Resistors Formed In A Semiconductor Device Comprising Metal Gates By Reducing Conductivity Of A Metal-containing Cap Material App 20110186916 - Kurz; Andreas ;   et al. | 2011-08-04 |
Technique for forming contact insulation layers and silicide regions with different characteristics Grant 7,838,359 - Schwan , et al. November 23, 2 | 2010-11-23 |
Method for patterning contact etch stop layers by using a planarization process Grant 7,838,354 - Frohberg , et al. November 23, 2 | 2010-11-23 |
Soi Device With A Buried Insulating Material Having Increased Etch Resistivity App 20100163994 - Kurz; Andreas ;   et al. | 2010-07-01 |
Semiconductor device including a vertical decoupling capacitor Grant 7,713,815 - Lehr , et al. May 11, 2 | 2010-05-11 |
Method of increasing transistor drive current by recessing an isolation trench Grant 7,659,170 - Schwan , et al. February 9, 2 | 2010-02-09 |
Semiconductor Device Comprising A Silicon/germanium Resistor App 20100025772 - Kurz; Andreas ;   et al. | 2010-02-04 |
Semiconductor Device Comprising Isolation Trenches Inducing Different Types Of Strain App 20090236667 - Schwan; Christoph ;   et al. | 2009-09-24 |
Method Of Creating A Strained Channel Region In A Transistor By Deep Implantation Of Strain-inducing Species Below The Channel Region App 20090194789 - Griebenow; Uwe ;   et al. | 2009-08-06 |
Field effect transistor having a stressed dielectric layer based on an enhanced device topography Grant 7,563,731 - Schwan , et al. July 21, 2 | 2009-07-21 |
Field effect transistor comprising a stressed channel region and method of forming the same Grant 7,556,996 - Schwan , et al. July 7, 2 | 2009-07-07 |
Method of making a semiconductor device comprising isolation trenches inducing different types of strain Grant 7,547,610 - Schwan , et al. June 16, 2 | 2009-06-16 |
Field Effect Transistor Having A Stressed Dielectric Layer Based On An Enhanced Device Topography App 20080081486 - Schwan; Christoph ;   et al. | 2008-04-03 |
Field Effect Transistor Comprising A Stressed Channel Region And Method Of Forming The Same App 20080079039 - Schwan; Christoph ;   et al. | 2008-04-03 |
Semiconductor Device Comprising Isolation Trenches Inducing Different Types Of Strain App 20080079085 - Schwan; Christoph ;   et al. | 2008-04-03 |
Method For Patterning Contact Etch Stop Layers By Using A Planarization Process App 20080057720 - Frohberg; Kai ;   et al. | 2008-03-06 |
Method of depositing a layer of a material on a substrate Grant 7,338,872 - Schwan , et al. March 4, 2 | 2008-03-04 |
Method Of Increasing Transistor Drive Current By Recessing An Isolation Trench App 20070278596 - Schwan; Christoph ;   et al. | 2007-12-06 |
Method of forming sidewall spacer elements for a circuit element by increasing an etch selectivity Grant 7,192,881 - Kammler , et al. March 20, 2 | 2007-03-20 |
Technique For Forming Contact Insulation Layers And Silicide Regions With Different Characteristics App 20070001233 - SCHWAN; CHRISTOPH ;   et al. | 2007-01-04 |
Semiconductor Device Including A Vertical Decoupling Capacitor App 20070001203 - LEHR; MATTHIAS ;   et al. | 2007-01-04 |
Method of compensating for etch rate non-uniformities by ion implantation Grant 7,098,140 - Schaller , et al. August 29, 2 | 2006-08-29 |
Method of forming a conformal spacer adjacent to a gate electrode structure Grant 7,064,071 - Schwan June 20, 2 | 2006-06-20 |
Signal layer for generating characteristic optical plasma emissions Grant 7,005,305 - Grasshoff , et al. February 28, 2 | 2006-02-28 |
Technique for forming recessed sidewall spacers for a polysilicon line Grant 7,005,358 - Kammler , et al. February 28, 2 | 2006-02-28 |
Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process Grant 6,969,676 - Schwan , et al. November 29, 2 | 2005-11-29 |
Wall construction and component for the same App 20050257467 - Schwan, Christoph | 2005-11-24 |
Method of forming sidewall spacers App 20050233532 - Lenski, Markus ;   et al. | 2005-10-20 |
Method of depositing a layer of a material on a substrate App 20050170660 - Schwan, Christoph ;   et al. | 2005-08-04 |
Method of forming sidewall spacer elements for a circuit element by increasing an etch selectivity App 20050118769 - Kammler, Thorsten ;   et al. | 2005-06-02 |
Method of forming a conformal spacer adjacent to a gate electrode structure App 20050048753 - Schwan, Christoph | 2005-03-03 |
Technique for forming recessed sidewall spacers for a polysilicon line App 20050026380 - Kammler, Thorsten ;   et al. | 2005-02-03 |
Method of compensating for etch rate non-uniformities by ion implantation App 20040266200 - Schaller, Matthias ;   et al. | 2004-12-30 |
Method of adjusting etch selectivity by adapting aspect ratios in a multi-level etch process App 20040241984 - Schwan, Christoph ;   et al. | 2004-12-02 |
Method of forming a substrate contact for an SOI semiconductor device App 20040241917 - Schwan, Christoph ;   et al. | 2004-12-02 |
Plasma parameter control using learning data App 20040118516 - Grasshoff, Gunter ;   et al. | 2004-06-24 |
Signal layer for generating characteristic optical plasma emissions App 20040106284 - Grasshoff, Gunter ;   et al. | 2004-06-03 |
Method for formation of a differential offset spacer Grant 6,696,334 - Hellig , et al. February 24, 2 | 2004-02-24 |