| Patent | Date |
|---|
Packaged semiconductor components having substantially rigid support members
Grant 10,763,185 - Schwab , et al. Sep | 2020-09-01 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 10,692,827 - Schwab , et al. | 2020-06-23 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20190252281 - Schwab; Matt E. ; et al. | 2019-08-15 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
Grant 10,312,173 - Schwab , et al. | 2019-06-04 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20190081015 - Schwab; Matt E. ; et al. | 2019-03-14 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 10,163,826 - Schwab , et al. Dec | 2018-12-25 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20180211896 - Schwab; Matt E. ; et al. | 2018-07-26 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
Grant 9,960,094 - Schwab , et al. May 1, 2 | 2018-05-01 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20180040582 - Schwab; Matt E. ; et al. | 2018-02-08 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 9,812,415 - Schwab , et al. November 7, 2 | 2017-11-07 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20160254204 - Schwab; Matt E. ; et al. | 2016-09-01 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
Grant 9,362,208 - Schwab , et al. June 7, 2 | 2016-06-07 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20150364403 - Schwab; Matt E. ; et al. | 2015-12-17 |
Packaged microdevices and methods for manufacturing packaged microdevices
Grant 8,987,885 - Roberts , et al. March 24, 2 | 2015-03-24 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20150021769 - Schwab; Matt E. ; et al. | 2015-01-22 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 8,866,272 - Schwab , et al. October 21, 2 | 2014-10-21 |
Packaged Microdevices And Methods For Manufacturing Packaged Microdevices
App 20130193581 - Roberts; Stuart L. ; et al. | 2013-08-01 |
Packaged microdevices and methods for manufacturing packaged microdevices
Grant 8,354,301 - Roberts , et al. January 15, 2 | 2013-01-15 |
Multi-chip module and methods
Grant 8,048,715 - Corisis , et al. November 1, 2 | 2011-11-01 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20110233740 - Schwab; Matt E. ; et al. | 2011-09-29 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 7,955,898 - Schwab , et al. June 7, 2 | 2011-06-07 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
Grant 7,944,057 - Corisis , et al. May 17, 2 | 2011-05-17 |
Packaged Microdevices And Methods For Manufacturing Packaged Microdevices
App 20110104857 - Roberts; Stuart L. ; et al. | 2011-05-05 |
Packaged microdevices and methods for manufacturing packaged microdevices
Grant 7,868,440 - Roberts , et al. January 11, 2 | 2011-01-11 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
Grant 7,851,922 - Corisis , et al. December 14, 2 | 2010-12-14 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20100255636 - Schwab; Matt E. ; et al. | 2010-10-07 |
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
Grant 7,750,449 - Schwab , et al. July 6, 2 | 2010-07-06 |
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices
App 20100078792 - Corisis; David J. ; et al. | 2010-04-01 |
Multi-chip Module And Methods
App 20100055837 - Corisis; David J. ; et al. | 2010-03-04 |
Multi-chip module and methods
Grant 7,619,313 - Corisis , et al. November 17, 2 | 2009-11-17 |
Bond Pad Rerouting Element, Rerouted Semiconductor Devices Including The Rerouting Element, And Assemblies Including The Rerouted Semiconductor Devices
App 20090008797 - Corisis; David J. ; et al. | 2009-01-08 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20080224329 - Schwab; Matt E. ; et al. | 2008-09-18 |
Packaged Semiconductor Components Having Substantially Rigid Support Members And Methods Of Packaging Semiconductor Components
App 20080224291 - Schwab; Matt E. ; et al. | 2008-09-18 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
Grant 7,423,336 - Corisis , et al. September 9, 2 | 2008-09-09 |
Routing element for use in semiconductor device assemblies
Grant 7,372,131 - Corisis , et al. May 13, 2 | 2008-05-13 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
Grant 7,372,138 - Corisis , et al. May 13, 2 | 2008-05-13 |
Integrated circuit device having reduced bow and method for making same
Grant 7,344,921 - Tandy , et al. March 18, 2 | 2008-03-18 |
Packaged microdevices and methods for manufacturing packaged microdevices
App 20080048316 - Roberts; Stuart L. ; et al. | 2008-02-28 |
Method of making a semiconductor device having an opening in a solder mask
Grant 7,335,571 - Rumsey , et al. February 26, 2 | 2008-02-26 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
Grant 7,282,805 - Corisis , et al. October 16, 2 | 2007-10-16 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
Grant 7,282,397 - Corisis , et al. October 16, 2 | 2007-10-16 |
Method of making a semiconductor device having an opening in a solder mask
Grant 7,263,768 - Rumsey , et al. September 4, 2 | 2007-09-04 |
Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial
Grant 7,146,720 - Rumsey , et al. December 12, 2 | 2006-12-12 |
Multi-chip module and methods
App 20060261492 - Corisis; David J. ; et al. | 2006-11-23 |
Integrated circuit device having reduced bow and method for making same
Grant 7,095,097 - Tandy , et al. August 22, 2 | 2006-08-22 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
Grant 7,094,631 - Corisis , et al. August 22, 2 | 2006-08-22 |
Multi-chip module and methods
Grant 7,084,514 - Corisis , et al. August 1, 2 | 2006-08-01 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
App 20060166404 - Corisis; David J. ; et al. | 2006-07-27 |
Integrated circuit device having reduced bow and method for making same
App 20060141673 - Tandy; William D. ; et al. | 2006-06-29 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
App 20060113650 - Corisis; David J. ; et al. | 2006-06-01 |
Solder resist opening to define a combination pin one indicator and fiducial
Grant 7,019,223 - Rumsey , et al. March 28, 2 | 2006-03-28 |
Method of fabricating a semiconductor device package
Grant 7,013,559 - Rumsey , et al. March 21, 2 | 2006-03-21 |
Methods for fabricating routing elements for multichip modules
Grant 6,995,043 - Corisis , et al. February 7, 2 | 2006-02-07 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
Grant 6,987,325 - Corisis , et al. January 17, 2 | 2006-01-17 |
Routing element for use in semiconductor device assemblies
App 20050156295 - Corisis, David J. ; et al. | 2005-07-21 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
App 20050156293 - Corisis, David J. ; et al. | 2005-07-21 |
Multi-chip module and methods
App 20050146009 - Corisis, David J. ; et al. | 2005-07-07 |
Method for making an integrated circuit package having reduced bow
Grant 6,887,740 - Tandy , et al. May 3, 2 | 2005-05-03 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
Grant 6,882,034 - Corisis , et al. April 19, 2 | 2005-04-19 |
Multi-chip module and methods
Grant 6,867,500 - Corisis , et al. March 15, 2 | 2005-03-15 |
Integrated circuit device having reduced bow and method for making same
App 20050023653 - Tandy, William D. ; et al. | 2005-02-03 |
Method of making a semiconductor device having an opening in a solder mask
App 20050022379 - Rumsey, Brad D. ; et al. | 2005-02-03 |
Method of making a semiconductor device having an opening in a solder mask
App 20050014348 - Rumsey, Brad D. ; et al. | 2005-01-20 |
Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices
App 20040142506 - Corisis, David J. ; et al. | 2004-07-22 |
Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
App 20040036182 - Corisis, David J. ; et al. | 2004-02-26 |
Method of making a semiconductor device having an opening in a solder mask
Grant 6,668,449 - Rumsey , et al. December 30, 2 | 2003-12-30 |
Integrated circuit device having reduced bow and method for making same
App 20030201547 - Tandy, William D. ; et al. | 2003-10-30 |
Multi-chip module and methods
App 20030189257 - Corisis, David J. ; et al. | 2003-10-09 |
Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, stacked chip assemblies including the rerouted semiconductor devices, and methods
App 20030189256 - Corisis, David J. ; et al. | 2003-10-09 |
Solder resist opening to define a combination pin one indicator and fiducial
App 20030110624 - Rumsey, Brad D. ; et al. | 2003-06-19 |
Solder resist opening to define a combination pin one indicator and fiducial
App 20030106711 - Rumsey, Brad D. ; et al. | 2003-06-12 |
Solder resist opening to define a combination pin one indicator and fiducial
App 20030093898 - Rumsey, Brad D. ; et al. | 2003-05-22 |
Routing element for use in multichip modules, multichip modules including the routing element, and methods
App 20030067060 - Corisis, David J. ; et al. | 2003-04-10 |
Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods
App 20030042585 - Corisis, David J. ; et al. | 2003-03-06 |
Solder resist opening to define a combination pin one indicator and fiducial
App 20030000738 - Rumsey, Brad D. ; et al. | 2003-01-02 |
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